Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

The Effect of Deep JFET and P-Well Implant of 1.2kV 4H-SiC MOSFETs

Journal Article · · IEEE Journal of the Electron Devices Society

Not provided.

Research Organization:
State Univ. of New York (SUNY), Albany, NY (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
DOE Contract Number:
EE0008710
OSTI ID:
1980396
Journal Information:
IEEE Journal of the Electron Devices Society, Vol. 10; ISSN 2168-6734
Publisher:
IEEE
Country of Publication:
United States
Language:
English

References (12)

Non-Isothermal Simulations to Optimize SiC MOSFETs for Enhanced Short-Circuit Ruggedness April 2020
Area-Efficient, 600V 4H-SiC JBS Diode-Integrated MOSFETs (JBSFETs) for Power Converter Applications March 2020
Improved Short-Circuit Ruggedness for 1.2kV 4H-SiC MOSFET Using a Deep P-Well Implemented by Channeling Implantation December 2021
Electrical characterization of 1.2kV SiC MOSFET at extremely high junction temperature May 2018
4.3 mΩcm2, 1100 V 4H-SiC Implantation and Epitaxial MOSFET October 2006
A comparative study of channel designs for SiC MOSFETs: Accumulation mode channel vs. inversion mode channel May 2017
Effective Channel Mobility in Epitaxial and Implanted 4H-SiC Lateral MOSFETs January 2008
Optimization of the JFET region of 1.2kV SiC MOSFETs for improved high frequency figure of merit (HF-FOM) October 2017
A 1-kV 4H-SiC Power DMOSFET Optimized for Low on-Resistance October 2007
Improved inversion channel mobility for 4H-SiC MOSFETs following high temperature anneals in nitric oxide April 2001
Fundamentals of Power Semiconductor Devices January 2008
An Inclusive Structural Analysis on the Design of 1.2kV 4H-SiC Planar MOSFETs January 2021

Similar Records

The Effect of Deep JFET and P-Well Implant of 1.2kV 4H-SiC MOSFETs
Journal Article · 2021 · IEEE Journal of the Electron Devices Society · OSTI ID:1896910

Improved Short-Circuit Ruggedness for 1.2kV 4H-SiC MOSFET Using a Deep P-Well Implemented by Channeling Implantation
Journal Article · 2021 · IEEE Electron Device Letters · OSTI ID:1980438

Related Subjects