System-on-chip integrated circuit technology applications on the DIII-D tokamak for multi-field measurements

Zheng, Y.; Yu, G. Y.; Chen, J.; Chen, Y.; Zhu, Y. L.; Domier, C. W.; Brower, D. L.; Luhmann, N. C.

doi:10.1088/1748-0221/17/01/c01013

System-on-chip integrated circuit technology applications on the DIII-D tokamak for multi-field measurements

Journal Article · 01 January 2022 · Journal of Instrumentation

DOI:https://doi.org/10.1088/1748-0221/17/01/c01013· OSTI ID:1979429

Zheng, Y.; Yu, G. Y.; Chen, J.; Chen, Y.; Zhu, Y. L.; Domier, C. W.; Brower, D. L.; Luhmann, N. C.

Several mm-wave diagnostics on the DIII-D tokamak provide multi-scale and multi-dimensional measurements of plasma profile evolution and turbulence fluctuations. Mm-wave fusion plasma diagnostics that adopt system-on-chip integrated circuit technology can provide better space utilization, flexible installation, and improved sensitivity. In order to further extend this technology for additional fusion facilities with a higher toroidal magnetic field, V-band (55–75 GHz) and F-band (90–140 GHz) chips for Microwave Imaging Reflectometer (MIR) and Electron Cyclotron Emission Imaging (ECEI) instruments are developed and tested in the Davis Millimeter Wave Research Center (DMRC). Current measurement data show that correlation between these SoC-based diagnostic instruments with other state-of-the-art diagnostics enables co-located multi-field turbulence fluctuation measurement.

Research Organization:: General Atomics, San Diego, CA (United States); Univ. of California, Los Angeles, CA (United States); Univ. of California, Davis, CA (United States)

Sponsoring Organization:: USDOE Office of Science (SC)

DOE Contract Number:: FC02-04ER54698; FG02-01ER54615; FG02-99ER54531

OSTI ID:: 1979429

Journal Information:: Journal of Instrumentation, Vol. 17, Issue 01; ISSN 1748-0221

Publisher:: Institute of Physics (IOP)

Country of Publication:: United States

Language:: English

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