Printed copper-nanoplate conductor for electro-magnetic interference

Li, Changning; Khuje, Saurabh; Petit, Donald; Huang, Yulong; Sheng, Aaron; An, Lu; Di Luigi, Massimigliano; Jalouli, Alireza; Navarro, Marieross; Islam, Abdullah; Ren, Shenqiang

doi:10.1088/1361-6528/ac40bc

Printed copper-nanoplate conductor for electro-magnetic interference

Journal Article · 21 December 2021 · Nanotechnology

DOI:https://doi.org/10.1088/1361-6528/ac40bc· OSTI ID:1979298

; Khuje, Saurabh; Petit, Donald; Huang, Yulong; ; ; Di Luigi, Massimigliano; ; Navarro, Marieross; Islam, Abdullah;

As one of the conductive ink materials with high electric conductivity, elemental copper (Cu) based nanocrystals promise for printable electronics. Here, single crystalline Cu nanoplates were synthesized using a facile hydrothermal method. Size engineering of Cu nanoplates can be rationalized by using the LaMer model and the versatile Cu conductive ink materials are suitable for different printing technologies. The printed Cu traces show high electric conductivity of 6 MS m^-1, exhibiting electro-magnetic interference shielding efficiency value of 75 dB at an average thicknesses of 11μm. Together with flexible alumina ceramic aerogel substrates, it kept 87% conductivity at the environmental temperature of 400 °C, demonstrating the potential of Cu conductive ink for high-temperature printable electronics applications.

Research Organization:: State Univ. of New York (SUNY), Albany, NY (United States)

Sponsoring Organization:: USDOE Office of Energy Efficiency and Renewable Energy (EERE)

DOE Contract Number:: EE0008675

OSTI ID:: 1979298

Journal Information:: Nanotechnology, Vol. 33, Issue 11; ISSN 0957-4484

Publisher:: IOP Publishing

Country of Publication:: United States

Language:: English

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