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Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics

Journal Article · · Nano Letters
 [1];  [2];  [3];  [1];  [3];  [4];  [4];  [5]
  1. Department of Chemistry, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States
  2. Department of Mechanical and Aerospace Engineering, Research and Education in Energy Environment & Water Institute, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States
  3. Army Research Laboratory, Aberdeen Proving Ground, Maryland 21005, United States
  4. Corning Research and Development Corporation, New York 14830, United States
  5. Department of Chemistry, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States; Department of Mechanical and Aerospace Engineering, Research and Education in Energy Environment & Water Institute, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States
+ Show Author Affiliations

Not provided.

Research Organization:
State Univ. of New York (SUNY), Albany, NY (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
DOE Contract Number:
EE0008675
OSTI ID:
1978172
Journal Information:
Nano Letters, Vol. 21, Issue 21; ISSN 1530-6984
Publisher:
American Chemical Society
Country of Publication:
United States
Language:
English

References (24)

A Review of Conductive Metal Nanomaterials as Conductive, Transparent, and Flexible Coatings, Thin Films, and Conductive Fillers: Different Deposition Methods and Applications August 2018
Flexible Electronics and Healthcare Applications March 2021
Flexible and Stretchable Electronics for Harsh‐Environmental Applications August 2019
Highly stable copper wire/alumina/polyimide composite films for stretchable and transparent heaters January 2016
Flexible shielding layers for solar cells in space applications: ARTICLE April 2016
Precision in harsh environments October 2016
High temperature silicon-carbide-based flexible electronics for monitoring hazardous environments July 2020
Recent Progress on Stretchable Electronic Devices with Intrinsically Stretchable Components November 2016
Printable Copper Sensor Electronics for High Temperature June 2020
Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics August 2020
2D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications December 2017
Visible Flip-Chip Light-Emitting Diodes on Flexible Ceramic Substrate With Improved Thermal Management May 2016
Status and prospects of Al 2 O 3 -based surface passivation schemes for silicon solar cells July 2012
Sensors design based on hybrid gold-silica nanostructures April 2020
Synthesis of Nanoparticles by Spark Discharge as a Facile and Versatile Technique of Preparing Highly Conductive Pt Nano-Ink for Printed Electronics January 2021
Multigram Synthesis of Cu-Ag Core-Shell Nanowires Enables the Production of a Highly Conductive Polymer Filament for 3D Printing Electronics January 2018
Hybrid Copper–Silver–Graphene Nanoplatelet Conductive Inks on PDMS for Oxidation Resistance Under Intensive Pulsed Light October 2017
Deep-Sintered Copper Tracks for Thermal Oxidation Resistance Using Large Pulsed Electron Beam July 2021
Oxidation Resistance of Graphene-Coated Cu and Cu/Ni Alloy January 2011
Cu Nanowires Passivated with Hexagonal Boron Nitride: An Ultrastable, Selectively Transparent Conductor May 2020
One hundred fold increase in current carrying capacity in a carbon nanotube–copper composite July 2013
Surface coordination layer passivates oxidation of copper October 2020
Enhanced Oxidation-Resistant Cu@Ni Core–Shell Nanoparticles for Printed Flexible Electrodes December 2017
Quantification of High‐Temperature Transition Al 2 O 3 and Their Phase Transformations** September 2020

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