Does the Mode of Metal–Organic Framework/Electrode Adhesion Determine Rates for Redox-Hopping-Based Charge Transport within Thin-Film Metal–Organic Frameworks?

Duan, Jiaxin; Goswami, Subhadip; Patwardhan, Sameer; Hupp, Joseph T.

doi:10.1021/acs.jpcc.1c09812

Does the Mode of Metal–Organic Framework/Electrode Adhesion Determine Rates for Redox-Hopping-Based Charge Transport within Thin-Film Metal–Organic Frameworks?

Journal Article · 28 February 2022 · Journal of Physical Chemistry. C

DOI:https://doi.org/10.1021/acs.jpcc.1c09812· OSTI ID:1978028

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Department of Chemistry, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208, United States

Not provided.

Research Organization:: Northwestern Univ., Evanston, IL (United States)

Sponsoring Organization:: USDOE Office of Science (SC)

DOE Contract Number:: FG02-87ER13808

OSTI ID:: 1978028

Journal Information:: Journal of Physical Chemistry. C, Vol. 126, Issue 9; ISSN 1932-7447

Publisher:: American Chemical Society

Country of Publication:: United States

Language:: English

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