An atomistic model for the thermal resistance of a liquid–solid interface
Journal Article
·
· Journal of Fluid Mechanics
The thermal resistance associated with the interface between a solid and a liquid is analysed from an atomistic point of view. Partial evaluation of the associated Green–Kubo integral elucidates the various factors governing heat transport across the interface and leads to a quantitative model for the thermal resistance in terms of atomistic-level system parameters. The model is validated using molecular dynamics simulations.
- Research Organization:
- Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- NA0003965
- OSTI ID:
- 1977726
- Journal Information:
- Journal of Fluid Mechanics, Vol. 934; ISSN 0022-1120
- Publisher:
- Cambridge University Press
- Country of Publication:
- United States
- Language:
- English
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