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Title: Enhancing thermal conductivity of fluids with nanoparticles

Abstract

Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids that are required in many industrial applications. In this paper we propose that an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat transfer fluids. The resulting {open_quotes}nanofluids{close_quotes} are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluids, and they represent the best hope for enhancement of heat transfer. The results of a theoretical study of the thermal conductivity of nanofluids with copper nanophase materials are presented, the potential benefits of the fluids are estimated, and it is shown that one of the benefits of nanofluids will be dramatic reductions in heat exchanger pumping power.

Authors:
;
Publication Date:
Research Org.:
Argonne National Lab., IL (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
196525
Report Number(s):
ANL/MSD/CP-84938; CONF-951135-29
ON: DE96004174; TRN: 96:001707
DOE Contract Number:  
W-31109-ENG-38
Resource Type:
Conference
Resource Relation:
Conference: 1995 International mechanical engineering congress and exhibition, San Francisco, CA (United States), 12-17 Nov 1995; Other Information: PBD: Oct 1995
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; HEAT TRANSFER FLUIDS; THERMAL CONDUCTIVITY; COPPER; FRICTION; PRESSURE DROP; REYNOLDS NUMBER; SUSPENSIONS

Citation Formats

Choi, S U.S., and Eastman, J A. Enhancing thermal conductivity of fluids with nanoparticles. United States: N. p., 1995. Web.
Choi, S U.S., & Eastman, J A. Enhancing thermal conductivity of fluids with nanoparticles. United States.
Choi, S U.S., and Eastman, J A. Sun . "Enhancing thermal conductivity of fluids with nanoparticles". United States. https://www.osti.gov/servlets/purl/196525.
@article{osti_196525,
title = {Enhancing thermal conductivity of fluids with nanoparticles},
author = {Choi, S U.S. and Eastman, J A},
abstractNote = {Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids that are required in many industrial applications. In this paper we propose that an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat transfer fluids. The resulting {open_quotes}nanofluids{close_quotes} are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluids, and they represent the best hope for enhancement of heat transfer. The results of a theoretical study of the thermal conductivity of nanofluids with copper nanophase materials are presented, the potential benefits of the fluids are estimated, and it is shown that one of the benefits of nanofluids will be dramatic reductions in heat exchanger pumping power.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {10}
}

Conference:
Other availability
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