System for providing dynamic feedback for selective adhesion PCB production

Patent · 06 September 2022

OSTI ID:1925084

Hatch, Jonathan Douglas; Hatch, Stephen McGarry

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

• Research Organization: Kansas City Plant (KCP), Kansas City, MO (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: NA0000622
• Assignee: Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
• Patent Number(s): 11,439,023
• Application Number: 16/816,607
• OSTI ID: 1925084
• Country of Publication: United States
• Language: English