Favorable Bonding and Band Structures of Cu[subscript 2]ZnSnS[subscript 4] and CdS Films and Their P

Turnbull, Matthew J.; Yiu, Yun Mui; Goldman, Maxwell; Sham, Tsun-Kong; Ding, Zhifeng

doi:10.1021/acsami.2c06892

Title: Favorable Bonding and Band Structures of Cu[subscript 2]ZnSnS[subscript 4] and CdS Films and Their P

Journal Article · 01 July 2022 · ACS Appl. Mater. Interfaces

DOI:https://doi.org/10.1021/acsami.2c06892· OSTI ID:1900701

Turnbull, Matthew J.; Yiu, Yun Mui; Goldman, Maxwell; Sham, Tsun-Kong; Ding, Zhifeng

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Research Organization:: Argonne National Laboratory (ANL), Argonne, IL (United States). Advanced Photon Source (APS)

Sponsoring Organization:: DOE - Office Of Science; FOREIGN

OSTI ID:: 1900701

Journal Information:: ACS Appl. Mater. Interfaces, Vol. 14, Issue (28)

Country of Publication:: United States

Language:: ENGLISH

References (69)

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