Conductive trace interconnection tape
A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.
- Research Organization:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- NA0002839
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
- Patent Number(s):
- 11,350,524
- Application Number:
- 17/067,901
- OSTI ID:
- 1893001
- Country of Publication:
- United States
- Language:
- English
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