High temperature optoelectronic devices for power electronics

Chen, Zhong; Yu, Shui-Qing; Mantooth, H. Alan; Wallace, Andrea; Madhusoodhanan, Syam

High temperature optoelectronic devices for power electronics

Patent · 10 May 2022

OSTI ID:1892924

Chen, Zhong; Yu, Shui-Qing; Mantooth, H. Alan; Wallace, Andrea; Madhusoodhanan, Syam

A high temperature optoelectronic isolator for power electronics operating above 250 degrees Celcius.

Research Organization:: US Dept. of Energy (USDOE), Washington, DC (United States)

Sponsoring Organization:: USDOE Office of Science (SC)

DOE Contract Number:: SC0016485

Assignee:: Chen, Zhong, Fayetteville, AR (United States)

Patent Number(s):: 11,329,209

Application Number:: 16/717,065

OSTI ID:: 1892924

Country of Publication:: United States

Language:: English

References (8)

Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests Wang, Jau-Sheng; Tsai, Chun-Chin; Liou, Jyun-Sian Microelectronics Reliability, Vol. 52, Issue 5 https://doi.org/10.1016/j.microrel.2011.07.057	journal	May 2012
Optocouplers for Hartlepool No authors listed Electronics and Power, Vol. 29, Issue 4, p. 287 https://doi.org/10.1049/ep.1983.0131	journal	January 1983
Failure mechanisms and package reliability issues in optocouplers Wu, Huiwei; He, Shengzong; Chen, Xuanlong 2016 17th International Conference on Electronic Packaging Technology (ICEPT) https://doi.org/10.1109/ICEPT.2016.7583348	conference	August 2016
Optical and Electronic Packaging Processes for Silicon Photonic Systems Pavarelli, Nicola; Lee, Jun Su; Rensing, Marc Journal of Lightwave Technology, Vol. 33, Issue 5 https://doi.org/10.1109/JLT.2015.2390675	journal	March 2015
High-temperature electronics - a role for wide bandgap semiconductors? Neudeck, P. G.; Okojie, R. S. Proceedings of the IEEE, Vol. 90, Issue 6 https://doi.org/10.1109/JPROC.2002.1021571	journal	June 2002
Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging Yao, Yiying; Chen, Zheng; Lu, Guo-Quan IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, Issue 4 https://doi.org/10.1109/TCPMT.2011.2173344	journal	April 2012
Opto-Electronic Chip-on-Film Packaging Technology Using Low-CTE Fluorinated Polyimide Optical Waveguide Films Usui, Mitsuo; Ishibashi, Shigeki; Hirata, Hirooki IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, Issue 10 https://doi.org/10.1109/TCPMT.2014.2345101	journal	October 2014
Survey of High-Temperature Reliability of Power Electronics Packaging Components Khazaka, R.; Mendizabal, L.; Henry, D. IEEE Transactions on Power Electronics, Vol. 30, Issue 5 https://doi.org/10.1109/TPEL.2014.2357836	journal	May 2015

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