Self-alignment features for III-V ridge process and angled facet die
Patent
·
OSTI ID:1892584
A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.
- Research Organization:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AR0000540
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Number(s):
- 11,239,631
- Application Number:
- 16/584,218
- OSTI ID:
- 1892584
- Country of Publication:
- United States
- Language:
- English
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension
|
conference | May 2016 |
A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities
|
journal | November 2016 |
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