Electroplated Au for conformal coating of high aspect ratio silicon structures

Rowen, Adam M.; Grubbs, Robert K.; Coleman, Jonathan Joseph

Electroplated Au for conformal coating of high aspect ratio silicon structures

Patent · 06 July 2021

OSTI ID:1840230

Rowen, Adam M.; Grubbs, Robert K.; Coleman, Jonathan Joseph

A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.

Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: AC04-94AL85000;

Assignee:: National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)

Patent Number(s):: 11,053,601

Application Number:: 16/174,744

OSTI ID:: 1840230

Country of Publication:: United States

Language:: English

References (8)

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Copper Electroplating on Zero-Thickness ALD Platinum for Nanoscale Computer Chip Interconnects Kaloyeros, Alain; Zhu, Yu; Dunn, Kathleen MRS Proceedings, Vol. 914 https://doi.org/10.1557/PROC-0914-F05-08	journal	January 2006
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