Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating.
Conference
·
OSTI ID:1786297
Abstract not provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1786297
- Report Number(s):
- SAND2020-5515C; 686350
- Resource Relation:
- Conference: Proposed for presentation at the ECS PRiME 2020 held October 4-9, 2020 in Honolulu, Hawaii.
- Country of Publication:
- United States
- Language:
- English
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