Additive Manufacturing of a W-Band System-on-Package

Craton, Michael Thomas; Konstantinou, Xenofon; Albrecht, John D.; Chahal, Premjeet; Papapolymerou, John

doi:10.1109/tmtt.2021.3076066

Additive Manufacturing of a W-Band System-on-Package

Journal Article · 01 September 2021 · IEEE Transactions on Microwave Theory and Techniques

DOI:https://doi.org/10.1109/tmtt.2021.3076066· OSTI ID:1763337

; ; Albrecht, John D.; Chahal, Premjeet;

View Journal Article

Research Organization:: Kansas City Plant (KCP), Kansas City, MO (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

DOE Contract Number:: NA0002839

OSTI ID:: 1763337

Report Number(s):: NSC-614-3334

Journal Information:: IEEE Transactions on Microwave Theory and Techniques, Journal Name: IEEE Transactions on Microwave Theory and Techniques Journal Issue: 9 Vol. 69; ISSN 0018-9480

Publisher:: IEEE

Country of Publication:: United States

Language:: English

References (28)

Morphological influences on the electrical sintering process of Aerosol Jet and Ink Jet printed silver microstructures Werner, Christian; Godlinski, Dirk; Zöllmer, Volker Journal of Materials Science: Materials in Electronics, Vol. 24, Issue 11 https://doi.org/10.1007/s10854-013-1412-y	journal	August 2013
Design and Development of a Package Using LCP for RF/Microwave MEMS Switches Chen, M. J.; Pham, A. -V. H.; Evers, N. A. IEEE Transactions on Microwave Theory and Techniques, Vol. 54, Issue 11 https://doi.org/10.1109/TMTT.2006.884639	journal	November 2006
MMIC packaging and on-chip low-loss lateral interconnection using additive manufacturing and laser machining Ramirez, Ramiro A.; Lan, Di; Wang, Jing 2017 IEEE MTT-S International Microwave Symposium (IMS) https://doi.org/10.1109/MWSYM.2017.8058582	conference	June 2017
Fully Inkjet-Printed Ramp Interconnects for Wireless Ka-Band MMIC Devices and Multi-Chip Module Packaging Tehrani, Bijan K.; Tentzeris, Manos M. 2018 48th European Microwave Conference (EuMC) https://doi.org/10.23919/EuMC.2018.8541741	conference	September 2018
Exploring 3-D Printing for New Applications: Novel Inkjet- and 3-D-Printed Millimeter-Wave Components, Interconnects, and Systems Bahr, Ryan; Tehrani, Bijan; Tentzeris, Manos M. IEEE Microwave Magazine, Vol. 19, Issue 1 https://doi.org/10.1109/MMM.2017.2759541	journal	January 2018
Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band Zhang, Yifei; Shi, Shouyuan; Martin, Richard D. IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, Issue 10 https://doi.org/10.1109/TCPMT.2017.2737550	journal	October 2017
Fully Additively Manufactured Broadband Low Loss High Frequency Interconnects Craton, Michael Thomas; Oakley, Christopher; Albrecht, John D. 2018 Asia-Pacific Microwave Conference (APMC) https://doi.org/10.23919/APMC.2018.8617327	conference	November 2018
A W-band CMOS PA encapsulated in an organic flip-chip package Patterson, Chad E.; Dawn, Debasis; Papapolymerou, John 2012 IEEE/MTT-S International Microwave Symposium Digest https://doi.org/10.1109/MWSYM.2012.6258427	conference	June 2012
Additive Manufacturing of a Wideband Capable W-Band Packaging Strategy Craton, Michael Thomas; Albrecht, John D.; Chahal, Premjeet IEEE Microwave and Wireless Components Letters, Vol. 31, Issue 6 https://doi.org/10.1109/LMWC.2021.3061614	journal	June 2021
LTCC-based monolithic system-in-package (SiP) module for millimeter-wave applications Lee, Young Chul; Park, Chul Soon International Journal of RF and Microwave Computer-Aided Engineering, Vol. 26, Issue 9 https://doi.org/10.1002/mmce.21032	journal	August 2016
Packaging a $W$-Band Integrated Module With an Optimized Flip-Chip Interconnect on an Organic Substrate Khan, Wasif Tanveer; Lopez, Aida L. Vera; Ulusoy, A. Cagri IEEE Transactions on Microwave Theory and Techniques, Vol. 62, Issue 1 https://doi.org/10.1109/TMTT.2013.2292832	journal	January 2014
3-D-Integrated RF and Millimeter-Wave Functions and Modules Using Liquid Crystal Polymer (LCP) System-on-Package Technology Tentzeris, M. M.; Laskar, J.; Papapolymerou, J. IEEE Transactions on Advanced Packaging, Vol. 27, Issue 2 https://doi.org/10.1109/TADVP.2004.828814	journal	May 2004
A Bi-material Fully Aerosol Jet printed W-band Quasi-Yagi-Uda Antenna He, Yuxiao; Craton, Michael Thomas; Chahal, Premjeet 2018 11th Global Symposium on Millimeter Waves (GSMM) https://doi.org/10.1109/GSMM.2018.8439233	conference	May 2018
In Situ Nanocomposite Fabrication for RF Electronics Applications With Additive Manufacturing Craton, Michael Thomas; Albrecht, John D.; Chahal, Premjeet IEEE Transactions on Microwave Theory and Techniques, Vol. 68, Issue 5 https://doi.org/10.1109/TMTT.2020.2977030	journal	May 2020
Accurate Models for Microstrip Computer-Aided Design Hammerstad, E.; Jensen, O. MTT-S International Microwave Symposium Digest https://doi.org/10.1109/MWSYM.1980.1124303	conference	January 1980
Inkwells for on-demand deposition rate measurement in aerosol-jet based 3D printing Gu, Yuan; Gutierrez, David; Das, Siddhartha Journal of Micromechanics and Microengineering, Vol. 27, Issue 9 https://doi.org/10.1088/1361-6439/aa817f	journal	August 2017
High-Performance Millimeter-Wave SOP Technology with Flip-Chip Interconnection Song, Sangsub; Maeng, Jimin; Lee, Heeseok 2007 Proceedings 57th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.2007.373920	conference	January 2007
Additively Manufactured mm-Wave Multichip Modules With Fully Printed “Smart” Encapsulation Structures He, Xuanke; Tehrani, Bijan K.; Bahr, Ryan IEEE Transactions on Microwave Theory and Techniques, Vol. 68, Issue 7 https://doi.org/10.1109/TMTT.2019.2956934	journal	July 2020
A Chip-First Approach to Millimeter-Wave Circuit Packaging Craton, Michael Thomas; Albrecht, John D.; Chahal, Premjeet IEEE Microwave and Wireless Components Letters, Vol. 29, Issue 2 https://doi.org/10.1109/LMWC.2018.2886737	journal	February 2019
Low-Loss Aerosol-Jet Printed Wideband Interconnects for Embedded Devices Oakley, Christopher; Albrecht, John D.; Papapolymerou, John IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, Issue 11 https://doi.org/10.1109/TCPMT.2019.2933792	journal	November 2019
A Chip-First Microwave Package Using Multimaterial Aerosol Jet Printing Craton, Michael Thomas; Konstantinou, Xenofon; Albrecht, John D. IEEE Transactions on Microwave Theory and Techniques, Vol. 68, Issue 8 https://doi.org/10.1109/TMTT.2020.2992074	journal	August 2020
Demonstration of RF and Microwave Passive Circuits Through 3-D Printing and Selective Metalization Byford, Jennifer A.; Ghazali, Mohd Ifwat Mohd; Karuppuswami, Saranraj IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, Issue 3 https://doi.org/10.1109/TCPMT.2017.2651645	journal	March 2017
Inkjet-printed 3D interconnects for millimeter-wave system-on-package solutions Tehrani, Bijan K.; Cook, Benjamin S.; Tentzeris, Manos M. 2016 IEEE MTT-S International Microwave Symposium (IMS) https://doi.org/10.1109/MWSYM.2016.7540084	conference	May 2016
Copper Nanoparticle/Multiwalled Carbon Nanotube Composite Films with High Electrical Conductivity and Fatigue Resistance Fabricated via Flash Light Sintering Hwang, Hyun-Jun; Joo, Sung-Jun; Kim, Hak-Sung ACS Applied Materials & Interfaces, Vol. 7, Issue 45 https://doi.org/10.1021/acsami.5b08112	journal	November 2015
Wideband coplanar waveguide RF probe pad to microstrip transitions without via holes No authors listed IEEE Microwave and Wireless Components Letters, Vol. 13, Issue 12 https://doi.org/10.1109/LMWC.2003.820638	journal	December 2003
Online Monitoring of Functional Electrical Properties in Aerosol Jet Printing Additive Manufacturing Process Using Shape-From-Shading Image Analysis Salary, Roozbeh (Ross); Lombardi, Jack P.; Rao, Prahalad K. Journal of Manufacturing Science and Engineering, Vol. 139, Issue 10 https://doi.org/10.1115/1.4036660	journal	August 2017
Metallic 3-D Printed Rectangular Waveguides for Millimeter-Wave Applications Zhang, Bing; Zirath, Herbert IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 6, Issue 5 https://doi.org/10.1109/TCPMT.2016.2550483	journal	May 2016
Functional Printing of MMIC-Interconnects on LTCC Packages for sub-THz applications Ihle, Martin; Ziesche, Steffen; Zech, Christian 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) https://doi.org/10.23919/EMPC44848.2019.8951799	conference	September 2019

Similar Records

Additive Manufacturing of Frequency-Agile W-Band Packaging

Conference · 2021 · OSTI ID:1725779

Systems and methods for additive manufacturing magnetic solenoids

Patent · 2023 · OSTI ID:1998520

Systems and methods for additive manufacturing magnetic solenoids

Patent · 2024 · OSTI ID:2542514

Additive Manufacturing of a W-Band System-on-Package

Citation Formats

References (28)

Similar Records

Related Subjects