Optically clear photo-polymerization resists for additive manufacturing of radiopaque parts

Saha, Sourabh Kumar; Oakdale, James Spencer

Title: Optically clear photo-polymerization resists for additive manufacturing of radiopaque parts

Patent · Tue Sep 22 00:00:00 EDT 2020

OSTI ID:1735288

Saha, Sourabh Kumar; Oakdale, James Spencer

According to one embodiment, a method includes contacting a triiodobenzoic acid with an oxalyl chloride in a solvent whereby triiodobenzoyl chloride is formed, contacting diethanolamine with triiodobenzoyl chloride where triiodobenzoic diol amine is formed, and forming an acrylate of triiodobenzoic diol amine with acryloyl chloride where an organoiodine compound is formed. According to another embodiment, an optically clear photopolymer resist blend for additive manufacturing includes a radiopaque pre-polymer compound where the compound includes at least one of the following: iodine, bromine, tin, lead, or bismuth. The resist blend also includes a photoinitiator, a polymerization inhibitor, and a base pre-polymer.

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Research Organization:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: AC52-07NA27344

Assignee:: Lawrence Livermore National Security, LLC (Livermore, CA)

Patent Number(s):: 10,781,315

Application Number:: 15/367,069

OSTI ID:: 1735288

Resource Relation:: Patent File Date: 12/01/2016

Country of Publication:: United States

Language:: English

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