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Title: Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion

Abstract

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

Inventors:
; ; ;
Publication Date:
Research Org.:
X Display Co. Technology, Ltd., Dublin (Ireland); Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735038
Patent Number(s):
10,717,267
Application Number:
15/195,747
Assignee:
X Display Company Technology Limited (Dublin, IE); The Board of Trustees of the University of Illinois (Urbana, IL)
DOE Contract Number:  
FG02-91ER45439
Resource Type:
Patent
Resource Relation:
Patent File Date: 06/28/2016
Country of Publication:
United States
Language:
English

Citation Formats

Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States: N. p., 2020. Web.
Menard, Etienne, Rogers, John A., Kim, Seok, & Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States.
Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. 2020. "Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion". United States. https://www.osti.gov/servlets/purl/1735038.
@article{osti_1735038,
title = {Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion},
author = {Menard, Etienne and Rogers, John A. and Kim, Seok and Carlson, Andrew},
abstractNote = {In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.},
doi = {},
url = {https://www.osti.gov/biblio/1735038}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {7}
}

Works referenced in this record:

Vertical interconnect for organic electronic devices
patent, August 2007


Apparatus and methods for micro-transfer-printing
patent, June 2016


Redundant imaging systems
patent, October 2006


Light emitting diode display with redundancy scheme
patent, January 2018


Methods for fabricating microstructures
patent, January 2016


Composite patterning devices for soft lithography
patent, March 2007


OLED display with photosensor
patent, August 2005


Substrates with transferable chiplets
patent, July 2016


Display device with an array of display drivers recessed onto a substrate
patent, February 2006


Imaging system having redundant pixel groupings
patent, June 2004


Pixel circuit, display panel, and driving method thereof
patent, July 2014


Methods of making dry adhesives
patent, June 2012


Methods for transferring elements from a template to a substrate
patent, April 2003


OLED device with embedded chip driving
patent, August 2011


OLED display architecture
patent, December 2012


Non-contact transfer printing
patent, January 2017


Stretchable semiconductor elements and stretchable electrical circuits
patent, July 2009


Electronic parts mounting apparatus
patent, April 1993


Smart pixel lighting and display microcontroller
patent, October 2015


Microcontact printing on surfaces and derivative articles
patent, January 2001


OLED display with improved power performance
patent, September 2009


Glass-based SOI structures
patent, October 2009


Light emitting unit and display device
patent, April 2014


Printing in a medium
patent, October 2008


Thermally managed LED arrays assembled by printing
patent, September 2017


Method of fabricating a TFT-EL pixel
patent, August 1996


Method of manufacturing a display panel
patent, December 2005


Flexible oled display with chiplets
patent, October 2010


Dry adhesives and methods for making dry adhesives
patent, March 2012


Self-illuminating imaging device
patent, April 2004


Light emitting diode display with redundancy scheme
patent, July 2014


Method of transferring a light emitting diode
patent, August 2014


Optical systems fabricated by printing-based assembly
patent, May 2014


Laser assisted transfer welding process
patent, October 2015


Arrays of ultrathin silicon solar microcells
patent, March 2014


High aspect ratio adhesive structure and a method of forming the same
patent, February 2015


Method to make low resistance contact
patent, April 2014


Printable inorganic semiconductor structures
patent, May 2017


Apparatus and methods for micro-transfer-printing
patent, January 2017


Substrates with transferable chiplets
patent, January 2015


Printable inorganic semiconductor method
patent, June 2016


Method for fabricating a semiconductor component based on GaN
patent, April 2010


LED with uniform current spreading and method of fabrication
patent, August 2013


Optical systems fabricated by printing-based assembly
patent, July 2011


Direct connect interconnect for testing semiconductor dice and wafers
patent, February 2000


Smart pixel lighting and display microcontroller
patent, April 2017


Decal transfer lithography
patent, February 2010


Micro assembled hybrid displays and lighting elements
patent, July 2017


Printable semiconductor structures and related methods of making and assembling
patent, September 2010