Environmental influence on cracking and debonding of electrically conductive adhesives

Springer, Martin; Bosco, N.

doi:10.1016/j.engfracmech.2020.107398

Title: Environmental influence on cracking and debonding of electrically conductive adhesives

Journal Article · Wed Nov 11 00:00:00 EST 2020 · Engineering Fracture Mechanics

DOI:https://doi.org/10.1016/j.engfracmech.2020.107398· OSTI ID:1726036

^[1]; Bosco, N. ^[1]

National Renewable Energy Lab. (NREL), Golden, CO (United States)

Electrically conductive adhesives (ECAs) are starting to replace metallic solders in recent designs of photovoltaic (PV) modules. This transition represents a significant material change, and a proper understanding of the durability and reliability of the new interconnect needs to be established. This paper presents our continued work on developing a degradation model for ECA interconnects in PV modules. Here, we characterize the fracture mechanics properties of an epoxy-based ECA, for both critical and subcritical, mode I and mode II loading conditions. Emphasis is on the influence of different environmental conditions such as temperature and humidity. We use the Finite Element Method to account for residual stresses, induced by temperature changes and moisture absorption, and correct the apparent fracture toughness. We found that high moisture levels not only can weaken the fracture resistance of the ECA interconnect, but can also promote subcritical debonding at significantly lower driving forces than in dry environments.

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Research Organization:: National Renewable Energy Lab. (NREL), Golden, CO (United States)

Sponsoring Organization:: USDOE Office of Energy Efficiency and Renewable Energy (EERE), Renewable Power Office. Solar Energy Technologies Office

Grant/Contract Number:: AC36-08GO28308

OSTI ID:: 1726036

Alternate ID(s):: OSTI ID: 1809265

Report Number(s):: NREL/JA-5K00-78264; MainId:32181; UUID:137e5713-f3af-4356-b312-3f4bc74a1b31; MainAdminID:18839

Journal Information:: Engineering Fracture Mechanics, Vol. 241; ISSN 0013-7944

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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42 ENGINEERING
electrically conductive adhesives
fracture properties
subcritical debonding
mode I
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photovoltaics

Title: Environmental influence on cracking and debonding of electrically conductive adhesives

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References (19)

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