Grinding force and microcrack density in abrasive machining of silicon nitride
- Ceramics Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899 (United States)
The relationship between grinding forces and the material`s resistance to microfracture is investigated in abrasive machining of silicon nitride ceramics. Surface grinding is performed on two forms of silicon nitride with different microstructures, and the grinding forces are measured. In addition, single-point scratching is performed on polished surfaces to amplify the damage associated with the action of an individual abrasive particle in grinding. A thermal wave measurement technique in then used on the cross sections to characterize the density of subsurface microcracks associated with scratching. Compared to a fine-grain silicon nitride, the density of microcracks in a coarse-grain silicon nitride is significantly larger, while the grinding force is smaller. The smaller grinding force for the coarse-grain silicon nitride is attributed to the ease of local intergranular microfracture and grain dislodgement during grinding. {copyright} {ital 1995} {ital Materials} {ital Research} {ital Society}.
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 168251
- Journal Information:
- Journal of Materials Research, Vol. 10, Issue 12; Other Information: PBD: Dec 1995
- Country of Publication:
- United States
- Language:
- English
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