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Title: Thermal evolution of ferroelectric behavior in epitaxial Hf0.5Zr0.5O2

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/5.0015547· OSTI ID:1760016
 [1];  [2]; ORCiD logo [2]; ORCiD logo [3]; ORCiD logo [4]
  1. Univ. of Illinois, Chicago, IL (United States); Argonne National Lab. (ANL), Lemont, IL (United States); Lab. for Oxide Research and Education, Chicago, IL (United States)
  2. Institut de Ciència de Materials de Barcelona (ICMAB-CSIC), Barcelona (Spain)
  3. Argonne National Lab. (ANL), Lemont, IL (United States)
  4. Univ. of Illinois, Chicago, IL (United States); Lab. for Oxide Research and Education, Chicago, IL (United States)

In this paper, we report a cryogenic-temperature study on the evolution of the ferroelectric properties of epitaxial Hf0.5Zr0.5O2 thin films on silicon. Wake-up, endurance, and fatigue of these films are found to be intricately correlated, strongly hysteretic, and dependent on available thermal energy. Field-dependent measurements reveal a decrease in polarization with temperature, which has been determined not to be an intrinsic change of the material property, rather a demonstration of the increase in the coercive bias of the material. Our findings suggest that a deficiency in thermal energy suppresses the mobility of defects presumed to be oxygen vacancies during wake-up and trapped injected charge during fatigue, which is responsible for polarization evolution during cycling. This permits accelerated wake-up and fatigue effects at high temperatures where thermal energy is abundant but delays these effects at cryogenic temperatures.

Research Organization:
Argonne National Laboratory (ANL), Argonne, IL (United States). Center for Nanoscale Materials (CNM)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division; National Science Foundation (NSF); Ministry of Science and Innovation; European Regional Development Fund (FEDER); Generalitat de Catalunya
Grant/Contract Number:
AC02-06CH11357; NSF-DMR-1508220; RYC-2017-22531
OSTI ID:
1760016
Alternate ID(s):
OSTI ID: 1670235
Journal Information:
Applied Physics Letters, Vol. 117, Issue 14; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

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