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Title: Input-output processing on a remote integrated circuit chip

Abstract

An electronic device includes a first integrated circuit chip including a processing functional block, and a second integrated circuit chip including an input-output (IO) functional block. The IO functional block performs one or more IO processing operations on behalf of the processing functional block in the first integrated circuit chip. The first integrated circuit chip lacks at least some elements of the IO functional block, so that the processing functional block is unable to perform corresponding IO operations without the IO functional block.

Inventors:
;
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1600428
Patent Number(s):
10,515,173
Application Number:
15/859,156
Assignee:
Advanced Micro Devices, Inc. (Santa Clara, CA)
DOE Contract Number:  
AC52-07NA27344; B620717
Resource Type:
Patent
Resource Relation:
Patent File Date: 12/29/2017
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Roberts, David A., and Gonzales, Dean. Input-output processing on a remote integrated circuit chip. United States: N. p., 2019. Web.
Roberts, David A., & Gonzales, Dean. Input-output processing on a remote integrated circuit chip. United States.
Roberts, David A., and Gonzales, Dean. Tue . "Input-output processing on a remote integrated circuit chip". United States. https://www.osti.gov/servlets/purl/1600428.
@article{osti_1600428,
title = {Input-output processing on a remote integrated circuit chip},
author = {Roberts, David A. and Gonzales, Dean},
abstractNote = {An electronic device includes a first integrated circuit chip including a processing functional block, and a second integrated circuit chip including an input-output (IO) functional block. The IO functional block performs one or more IO processing operations on behalf of the processing functional block in the first integrated circuit chip. The first integrated circuit chip lacks at least some elements of the IO functional block, so that the processing functional block is unable to perform corresponding IO operations without the IO functional block.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {12}
}

Patent:

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Works referenced in this record:

Control scheme for 3D memory IC
patent, April 2015


Switch fabric support for overlay network features
patent, May 2016


Wafer level I/O test, repair and/or customization enabled by I/O layer
patent, March 2011


Dual row I/O with logic embedded between rows
patent, March 2015