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Title: Self-alignment features for III-V ridge process and angled facet die

Abstract

A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.

Inventors:
; ;
Publication Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1600339
Patent Number(s):
10,490,971
Application Number:
15/618,958
Assignee:
International Business Machines Corporation (Armonk, NY)
DOE Contract Number:  
AR0000540
Resource Type:
Patent
Resource Relation:
Patent File Date: 06/09/2017
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; 42 ENGINEERING

Citation Formats

Barwicz, Tymon, Martin, Yves C., and Orcutt, Jason S. Self-alignment features for III-V ridge process and angled facet die. United States: N. p., 2019. Web.
Barwicz, Tymon, Martin, Yves C., & Orcutt, Jason S. Self-alignment features for III-V ridge process and angled facet die. United States.
Barwicz, Tymon, Martin, Yves C., and Orcutt, Jason S. Tue . "Self-alignment features for III-V ridge process and angled facet die". United States. https://www.osti.gov/servlets/purl/1600339.
@article{osti_1600339,
title = {Self-alignment features for III-V ridge process and angled facet die},
author = {Barwicz, Tymon and Martin, Yves C. and Orcutt, Jason S.},
abstractNote = {A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {11}
}

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Works referenced in this record:

Surface emitting and receiving photonic device with lens
patent, July 2007


Process for forming the ridge structure of a self-aligned semiconductor laser
patent, October 1991


High reliability etched-facet photonic devices
patent, July 2014


Assembly of electronic and optical devices
patent, June 2016


Self-aligned optical waveguide to laser structure and method for making the same
patent, November 1993


Alignment apparatus and method for aligning stacked devices
patent, November 2007