skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Non-Equilibrium Processes, Stability, Design and Control of Pulsed Plasmas for Materials Processing

Abstract

The energy and angle of impact of ions, interspersed with fluxes of neutral radicals, on the surface of wafers during plasma materials processing are critical parameters for the fabrication of microelectronic devices, nanostructure materials and biocompatible materials. This sensitivity extends to nearly all applications of plasmas to materials processing and surface modification. Low temperature plasmas for plasma materials processing have traditionally used continuously excited plasmas. However, pulsed plasma processing is an enabling technology for achieving finer resolution of microelectronics fabrication and for producing unique surface properties in a wide range of applications. This research project is addressing fundamental plasma physics issues in materials processing – the control of pulsed plasmas and the means for optimizing plasma produced reactant fluxes. NOTE: This project was jointly funded between the National Science Foundation and DOE as part of the NSF/DOE Partnership in Basic Plasma Science and Engineering. Products listed in this report include publications and presentations supported in full or in part by both of the grants contributing to the joint project: NSF PHY-1500126 or DOE DE-SC0014132. This report also lists products whose major funding was from other grants while also having intellectual and personnel contributions from this grant.

Authors:
ORCiD logo [1]
  1. University of Michigan
Publication Date:
Research Org.:
University of oMichigan
Sponsoring Org.:
USDOE Office of Science (SC), Fusion Energy Sciences (FES) (SC-24)
Contributing Org.:
National Science Foundation
OSTI Identifier:
1596482
Report Number(s):
Final Report-UMichigan-AWD002479
DOE Contract Number:  
SC0014132
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
70 PLASMA PHYSICS AND FUSION TECHNOLOGY; plasma materials processing modeling plasma chemistry plasma-surface interactions

Citation Formats

Kushner, Mark J. Non-Equilibrium Processes, Stability, Design and Control of Pulsed Plasmas for Materials Processing. United States: N. p., 2020. Web. doi:10.2172/1596482.
Kushner, Mark J. Non-Equilibrium Processes, Stability, Design and Control of Pulsed Plasmas for Materials Processing. United States. doi:10.2172/1596482.
Kushner, Mark J. Sat . "Non-Equilibrium Processes, Stability, Design and Control of Pulsed Plasmas for Materials Processing". United States. doi:10.2172/1596482. https://www.osti.gov/servlets/purl/1596482.
@article{osti_1596482,
title = {Non-Equilibrium Processes, Stability, Design and Control of Pulsed Plasmas for Materials Processing},
author = {Kushner, Mark J.},
abstractNote = {The energy and angle of impact of ions, interspersed with fluxes of neutral radicals, on the surface of wafers during plasma materials processing are critical parameters for the fabrication of microelectronic devices, nanostructure materials and biocompatible materials. This sensitivity extends to nearly all applications of plasmas to materials processing and surface modification. Low temperature plasmas for plasma materials processing have traditionally used continuously excited plasmas. However, pulsed plasma processing is an enabling technology for achieving finer resolution of microelectronics fabrication and for producing unique surface properties in a wide range of applications. This research project is addressing fundamental plasma physics issues in materials processing – the control of pulsed plasmas and the means for optimizing plasma produced reactant fluxes. NOTE: This project was jointly funded between the National Science Foundation and DOE as part of the NSF/DOE Partnership in Basic Plasma Science and Engineering. Products listed in this report include publications and presentations supported in full or in part by both of the grants contributing to the joint project: NSF PHY-1500126 or DOE DE-SC0014132. This report also lists products whose major funding was from other grants while also having intellectual and personnel contributions from this grant.},
doi = {10.2172/1596482},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {2}
}

Works referenced in this record:

Helium plasma jet interactions with water in well plates
journal, December 2019

  • Mohades, Soheila; Lietz, Amanda M.; Kruszelnicki, Juliusz
  • Plasma Processes and Polymers
  • DOI: 10.1002/ppap.201900179

Atmospheric pressure plasma jets onto a reactive water layer over tissue: pulse repetition rate as a control mechanism
journal, October 2018

  • Norberg, Seth A.; Parsey, Guy M.; Lietz, Amanda M.
  • Journal of Physics D: Applied Physics, Vol. 52, Issue 1
  • DOI: 10.1088/1361-6463/aae41e

The 2017 Plasma Roadmap: Low temperature plasma science and technology
journal, July 2017

  • Adamovich, I.; Baalrud, S. D.; Bogaerts, A.
  • Journal of Physics D: Applied Physics, Vol. 50, Issue 32
  • DOI: 10.1088/1361-6463/aa76f5

Effects of a chirped bias voltage on ion energy distributions in inductively coupled plasma reactors
journal, August 2017

  • Lanham, Steven J.; Kushner, Mark J.
  • Journal of Applied Physics, Vol. 122, Issue 8
  • DOI: 10.1063/1.4993785

Plasma etching of high aspect ratio features in SiO 2 using Ar/C 4 F 8 /O 2 mixtures: A computational investigation
journal, May 2019

  • Huang, Shuo; Huard, Chad; Shim, Seungbo
  • Journal of Vacuum Science & Technology A, Vol. 37, Issue 3
  • DOI: 10.1116/1.5090606

Molecular admixtures and impurities in atmospheric pressure plasma jets
journal, October 2018

  • Lietz, Amanda M.; Kushner, Mark J.
  • Journal of Applied Physics, Vol. 124, Issue 15
  • DOI: 10.1063/1.5049430

Time-resolved evolution of micro-discharges, surface ionization waves and plasma propagation in a two-dimensional packed bed reactor
journal, August 2018

  • Engeling, Kenneth W.; Kruszelnicki, Juliusz; Kushner, Mark J.
  • Plasma Sources Science and Technology, Vol. 27, Issue 8
  • DOI: 10.1088/1361-6595/aad2c5

Filamentation of capacitively coupled plasmas in large magnetic fields
journal, June 2019

  • Menati, Mohamad; Thomas, Edward; Kushner, Mark J.
  • Physics of Plasmas, Vol. 26, Issue 6
  • DOI: 10.1063/1.5092600

Atmospheric pressure plasma activation of water droplets
journal, July 2019

  • Kruszelnicki, Juliusz; Lietz, Amanda M.; Kushner, Mark J.
  • Journal of Physics D: Applied Physics, Vol. 52, Issue 35
  • DOI: 10.1088/1361-6463/ab25dc

Insights to scaling remote plasma sources sustained in NF 3 mixtures
journal, May 2017

  • Huang, Shuo; Volynets, Vladimir; Hamilton, James R.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 35, Issue 3
  • DOI: 10.1116/1.4978551

Atomic layer etching of 3D structures in silicon: Self-limiting and nonideal reactions
journal, May 2017

  • Huard, Chad M.; Zhang, Yiting; Sriraman, Saravanapriyan
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 35, Issue 3
  • DOI: 10.1116/1.4979661

Consequences of atomic layer etching on wafer scale uniformity in inductively coupled plasmas
journal, March 2018

  • Huard, Chad M.; Lanham, Steven J.; Kushner, Mark J.
  • Journal of Physics D: Applied Physics, Vol. 51, Issue 15
  • DOI: 10.1088/1361-6463/aab322

Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features
journal, September 2017

  • Huard, Chad M.; Zhang, Yiting; Sriraman, Saravanapriyan
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 35, Issue 5
  • DOI: 10.1116/1.4973953

Downstream etching of silicon nitride using continuous-wave and pulsed remote plasma sources sustained in Ar/NF 3 /O 2 mixtures
journal, March 2018

  • Huang, Shuo; Volynets, Vladimir; Hamilton, James R.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 36, Issue 2
  • DOI: 10.1116/1.5019673

Plasma-induced flow instabilities in atmospheric pressure plasma jets
journal, September 2017

  • Lietz, Amanda M.; Johnsen, Eric; Kushner, Mark J.
  • Applied Physics Letters, Vol. 111, Issue 11
  • DOI: 10.1063/1.4996192

Pattern dependent profile distortion during plasma etching of high aspect ratio features in SiO 2
journal, March 2020

  • Huang, Shuo; Shim, Seungbo; Nam, Sang Ki
  • Journal of Vacuum Science & Technology A, Vol. 38, Issue 2
  • DOI: 10.1116/1.5132800

Three-dimensional measurements of plasma parameters in an inductively coupled plasma processing chamber
journal, October 2019

  • Han, Jia; Pribyl, Patrick; Gekelman, Walter
  • Physics of Plasmas, Vol. 26, Issue 10
  • DOI: 10.1063/1.5115415

Electrode configurations in atmospheric pressure plasma jets: production of reactive species
journal, October 2018

  • Lietz, Amanda M.; Kushner, Mark J.
  • Plasma Sources Science and Technology, Vol. 27, Issue 10
  • DOI: 10.1088/1361-6595/aadf5b

Investigation of feature orientation and consequences of ion tilting during plasma etching with a three-dimensional feature profile simulator
journal, March 2017

  • Zhang, Yiting; Huard, Chad; Sriraman, Saravanapriyan
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 35, Issue 2
  • DOI: 10.1116/1.4968392

Controlling VUV photon fluxes in pulsed inductively coupled Ar/Cl 2 plasmas and potential applications in plasma etching
journal, January 2017


Properties of arrays of microplasmas: application to control of electromagnetic waves
journal, October 2017

  • Qu, Chenhui; Tian, Peng; Semnani, Abbas
  • Plasma Sources Science and Technology, Vol. 26, Issue 10
  • DOI: 10.1088/1361-6595/aa8d53

Air plasma treatment of liquid covered tissue: long timescale chemistry
journal, September 2016


The consequences of air flow on the distribution of aqueous species during dielectric barrier discharge treatment of thin water layers
journal, September 2016


Transient behavior in quasi-atomic layer etching of silicon dioxide and silicon nitride in fluorocarbon plasmas
journal, November 2018

  • Huard, Chad M.; Sriraman, Saravanapriyan; Paterson, Alex
  • Journal of Vacuum Science & Technology A, Vol. 36, Issue 6
  • DOI: 10.1116/1.5049225

Ionization wave propagation in an atmospheric pressure plasma multi-jet
journal, December 2019

  • Lietz, Amanda M.; Damany, Xavier; Robert, Eric
  • Plasma Sources Science and Technology, Vol. 28, Issue 12
  • DOI: 10.1088/1361-6595/ab4ab0

Formation of surface ionization waves in a plasma enhanced packed bed reactor for catalysis applications
journal, February 2020

  • Mujahid, Zaka-ul-Islam; Kruszelnicki, Juliusz; Hala, Ahmed
  • Chemical Engineering Journal, Vol. 382
  • DOI: 10.1016/j.cej.2019.123038