Adhesion, microstructure and electrical resistance of sputtered Cu films on alumina substrates [Slide]
Cu film thickness is grossly underestimated by using Oxford instrument (electrical resistance)
- Research Organization:
- Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- 89233218CNA000001
- OSTI ID:
- 1569566
- Report Number(s):
- LA-UR-19-29638
- Country of Publication:
- United States
- Language:
- English
Similar Records
Electrical resistivity of sputtered Cu/Cr multilayered thin films
Microstructural Comparisons of Ultra-Thin Cu Films Deposited by Ion-Beam and dc-Magnetron Sputtering
Microwave surface resistance of magnetron-sputtered Tl-Ba-Ca-Cu-O films on silver substrates
Journal Article
·
Fri Jan 01 00:00:00 EST 1999
· Journal of Applied Physics
·
OSTI ID:1569566
+4 more
Microstructural Comparisons of Ultra-Thin Cu Films Deposited by Ion-Beam and dc-Magnetron Sputtering
Technical Report
·
Thu Nov 04 00:00:00 EST 2004
·
OSTI ID:1569566
Microwave surface resistance of magnetron-sputtered Tl-Ba-Ca-Cu-O films on silver substrates
Journal Article
·
Mon May 21 00:00:00 EDT 1990
· Applied Physics Letters; (USA)
·
OSTI ID:1569566
+4 more