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Title: Adhesion, microstructure and electrical resistance of sputtered Cu films on alumina substrates


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Usov, Igor Olegovich, Waschezyn, David M., Vodnik, Douglas R., Waked, Robert Ryan, Middlemas, Michael Robert, Schneider, Matthew M., and Holesinger, Terry George. Adhesion, microstructure and electrical resistance of sputtered Cu films on alumina substrates. United States: N. p., 2019. Web. doi:10.2172/1569566.
Usov, Igor Olegovich, Waschezyn, David M., Vodnik, Douglas R., Waked, Robert Ryan, Middlemas, Michael Robert, Schneider, Matthew M., & Holesinger, Terry George. Adhesion, microstructure and electrical resistance of sputtered Cu films on alumina substrates. United States. doi:10.2172/1569566.
Usov, Igor Olegovich, Waschezyn, David M., Vodnik, Douglas R., Waked, Robert Ryan, Middlemas, Michael Robert, Schneider, Matthew M., and Holesinger, Terry George. Tue . "Adhesion, microstructure and electrical resistance of sputtered Cu films on alumina substrates". United States. doi:10.2172/1569566. https://www.osti.gov/servlets/purl/1569566.
@article{osti_1569566,
title = {Adhesion, microstructure and electrical resistance of sputtered Cu films on alumina substrates},
author = {Usov, Igor Olegovich and Waschezyn, David M. and Vodnik, Douglas R. and Waked, Robert Ryan and Middlemas, Michael Robert and Schneider, Matthew M. and Holesinger, Terry George},
abstractNote = {},
doi = {10.2172/1569566},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {9}
}

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