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Title: High Density Chip Interconnect Technology Using High Density Glass Interposers.

Abstract

Modern particle physics experiments require “intelligent detectors” with dense interconnects and distributed intelligence in very large area detector systems. Available packaging and interconnect technologies directly limit the performance and capabilities of these systems. Interposers are interconnected elements that use through-silicon or through-glass via to replace the PC board technology currently used for connecting chips and can improve the interconnect density by more than two orders of magnitude. The goal of this project is to fabricate a thru glass via interposer that will allow top to bottom side interconnects in the tens of microns. Having a thru glass interposer with interconnects in the tens of microns will benefit the electrons industry which focuses on 3D packaging. In addition to commercial, medical applications such as the CAT scan, which have resolutions in the micron or larger range, will now be able to use these interposers to diagnose in the tens of microns.

Authors:
Publication Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Org.:
USDOE Office of Science (SC), High Energy Physics (HEP) (SC-25)
Contributing Org.:
Collier Ventures, Inc.
OSTI Identifier:
1569232
Report Number(s):
FERMILAB-CRADA-FRA-2017-0047
oai:inspirehep.net:1757259
DOE Contract Number:  
AC02-07CH11359
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY

Citation Formats

Fermi Research Alliance. High Density Chip Interconnect Technology Using High Density Glass Interposers.. United States: N. p., 2019. Web. doi:10.2172/1569232.
Fermi Research Alliance. High Density Chip Interconnect Technology Using High Density Glass Interposers.. United States. doi:10.2172/1569232.
Fermi Research Alliance. Tue . "High Density Chip Interconnect Technology Using High Density Glass Interposers.". United States. doi:10.2172/1569232. https://www.osti.gov/servlets/purl/1569232.
@article{osti_1569232,
title = {High Density Chip Interconnect Technology Using High Density Glass Interposers.},
author = {Fermi Research Alliance},
abstractNote = {Modern particle physics experiments require “intelligent detectors” with dense interconnects and distributed intelligence in very large area detector systems. Available packaging and interconnect technologies directly limit the performance and capabilities of these systems. Interposers are interconnected elements that use through-silicon or through-glass via to replace the PC board technology currently used for connecting chips and can improve the interconnect density by more than two orders of magnitude. The goal of this project is to fabricate a thru glass via interposer that will allow top to bottom side interconnects in the tens of microns. Having a thru glass interposer with interconnects in the tens of microns will benefit the electrons industry which focuses on 3D packaging. In addition to commercial, medical applications such as the CAT scan, which have resolutions in the micron or larger range, will now be able to use these interposers to diagnose in the tens of microns.},
doi = {10.2172/1569232},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {7}
}

Technical Report:

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