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Title: Power module assembly with dual substrates and reduced inductance

Abstract

A power module assembly has a first substrate including a first layer, second layer and a third layer. The first layer is configured to carry a switch current flowing in a first direction. A second substrate is operatively connected to the first substrate and includes a fourth layer, fifth layer and a sixth layer. A conductive joining layer connects the third layer of the first substrate and the fourth layer of the second substrate. The conductive joining layer may be a first sintered layer. The third layer of the first substrate, the first sintered layer and the fourth layer of the second substrate are configured to function together as a unitary conducting layer carrying the switch current in a second direction substantially opposite to the first direction. The net inductance is reduced by a cancellation effect of the switch current going in opposite directions.

Inventors:
; ;
Publication Date:
Research Org.:
GM Global Technology Operations LLC, Detroit, MI (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1568311
Patent Number(s):
10,283,475
Application Number:
15/378,154
Assignee:
GM Global Technology Operations LLC (Detroit, MI)
DOE Contract Number:  
EE0007285
Resource Type:
Patent
Resource Relation:
Patent File Date: 12/14/2016
Country of Publication:
United States
Language:
English

Citation Formats

Ward, Terence G., Stancu, Constantin C., and Jaksic, Marko. Power module assembly with dual substrates and reduced inductance. United States: N. p., 2019. Web.
Ward, Terence G., Stancu, Constantin C., & Jaksic, Marko. Power module assembly with dual substrates and reduced inductance. United States.
Ward, Terence G., Stancu, Constantin C., and Jaksic, Marko. Tue . "Power module assembly with dual substrates and reduced inductance". United States. https://www.osti.gov/servlets/purl/1568311.
@article{osti_1568311,
title = {Power module assembly with dual substrates and reduced inductance},
author = {Ward, Terence G. and Stancu, Constantin C. and Jaksic, Marko},
abstractNote = {A power module assembly has a first substrate including a first layer, second layer and a third layer. The first layer is configured to carry a switch current flowing in a first direction. A second substrate is operatively connected to the first substrate and includes a fourth layer, fifth layer and a sixth layer. A conductive joining layer connects the third layer of the first substrate and the fourth layer of the second substrate. The conductive joining layer may be a first sintered layer. The third layer of the first substrate, the first sintered layer and the fourth layer of the second substrate are configured to function together as a unitary conducting layer carrying the switch current in a second direction substantially opposite to the first direction. The net inductance is reduced by a cancellation effect of the switch current going in opposite directions.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {5}
}

Patent:

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