Power module assembly with dual substrates and reduced inductance
A power module assembly has a first substrate including a first layer, second layer and a third layer. The first layer is configured to carry a switch current flowing in a first direction. A second substrate is operatively connected to the first substrate and includes a fourth layer, fifth layer and a sixth layer. A conductive joining layer connects the third layer of the first substrate and the fourth layer of the second substrate. The conductive joining layer may be a first sintered layer. The third layer of the first substrate, the first sintered layer and the fourth layer of the second substrate are configured to function together as a unitary conducting layer carrying the switch current in a second direction substantially opposite to the first direction. The net inductance is reduced by a cancellation effect of the switch current going in opposite directions.
- Research Organization:
- GM Global Technology Operations LLC, Detroit, MI (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0007285
- Assignee:
- GM Global Technology Operations LLC (Detroit, MI)
- Patent Number(s):
- 10,283,475
- Application Number:
- 15/378,154
- OSTI ID:
- 1568311
- Resource Relation:
- Patent File Date: 12/14/2016
- Country of Publication:
- United States
- Language:
- English
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