Lateral vias for connections to buried microconductors and methods thereof
Patent
·
OSTI ID:1568212
The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
- Research Organization:
- National Technology & Engineering Solutions of Sandia, LLC, Albuquerque, NM (United States); Varioscale, Inc., San Marcos, CA (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- NA0003525
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM); Varioscale, Inc. (San Marcos, CA)
- Patent Number(s):
- 10,262,931
- Application Number:
- 15/980,546
- OSTI ID:
- 1568212
- Country of Publication:
- United States
- Language:
- English
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