skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Decentralized Carrier Interleaving in Cascaded Multilevel DC-AC Converters: Preprint

Conference ·
 [1];  [1];  [2];  [2];  [3];  [2];  [1]
  1. University of Washington
  2. University of Colorado
  3. National Renewable Energy Laboratory (NREL), Golden, CO (United States)

Cascaded dc-ac converters with interleaved carriers are commonly used in applications where elevated voltages and low-distortion multilevel waveforms are needed. Example applications include modular multilevel converters and solid-state transformers. In such systems, carrier interleaving is generally achieved via communication among the stacked converters or a centralized controller. Due to the large number of converters in such a system, existing approaches entail significant wiring complexity and communication may limit resilience to failures. In this paper, we introduce a control strategy which achieves communication-free carrier interleaving among series-connected converters. The proposed controller is embedded within each converter control loop and only requires measurements available at each set of converter terminals. We formulate a dynamic system model and show that the system converges to the interleaved condition irrespective of the number of converters in the stack. After outlining a practical method for digital implementation, experiments are shown on a hardware-in-the-loop setup.

Research Organization:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Renewable Power Office. Solar Energy Technologies Office; USDOE National Renewable Energy Laboratory (NREL), Laboratory Directed Research and Development (LDRD) Program
DOE Contract Number:
AC36-08GO28308
OSTI ID:
1562440
Report Number(s):
NREL/CP-5D00-74846
Resource Relation:
Conference: Presented at the 2019 20th Workshop on Control and Modeling for Power Electronics (IEEE COMPEL), 17-20 June 2019, Toronto, Canada
Country of Publication:
United States
Language:
English