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Title: Maximizing the Performance of a 3D Printed Heat Sink by Accounting for Anisotropic Thermal Conductivity During Filament Deposition

Conference ·

Newly developed high thermal conductivity polymer composite 3D printing filaments are used to characterize the thermal properties as a function of print orientation. The thermal conductivity of a printed part is anisotropic and varies by 2-6 times depending on the print direction - demonstrating higher conductivity in the deposition direction (in-plane) than in the two directions perpendicular to the deposition direction (cross-plane and through-plane). Therefore, deposition path planning greatly affects the overall heat dissipation rate and the performance of the heat sink. Traditionally, 3D printing slicers generate deposition paths based solely on geometric constraints. This work investigates a new approach of deposition path planning assisted by computational predictions of the heat sink thermal performance. The proposed approach uses a thermal simulation of a 3D-printed part, accounting for the anisotropic thermal properties, and the orientation of the local material properties are assigned based on the deposition path in multiple print orientations. The performances predicted via the simulations are compared, and the optimal deposition path is determined. For the highest thermal conductivity 3D printing filament (~ 12 W/m- K in-plane), a heat sink printed with the print direction parallel to the fins z-axis had ~20% improved performance in comparison to a heat sink with print direction perpendicular to the fins z-axis. Moreover, a plastic 3D printed heat sink was able to perform within 7% of an extruded Aluminum heat sink with similar geometry under natural convection. The computational predictions show the same trend as experimental measurements using 3D printed heat sinks.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
DOE Contract Number:
AC05-00OR22725
OSTI ID:
1560483
Resource Relation:
Conference: 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE ITherm 2019) - Las Vegas, Nevada, United States of America - 5/28/2019 8:00:00 AM-5/31/2019 8:00:00 AM
Country of Publication:
United States
Language:
English

References (15)

Optimum design of a radial heat sink under natural convection journal May 2011
Natural convection around a radial heat sink journal June 2010
Thermal conductivity of polymer-based composites: Fundamentals and applications journal August 2016
Thermal analysis of additive manufacturing of large-scale thermoplastic polymer composites journal October 2017
High through-plane thermal conductivity of polymer based product with vertical alignment of graphite flakes achieved via 3D printing journal June 2017
A Stepped-Bar Apparatus for Thermal Resistance Measurements journal August 2013
Thermal Interface Material Enablement of Off-Board Two-Phase Cooling conference May 2018
Thermal conductivity of polymers journal October 1977
Anisotropy of thermal conductivity in 3D printed polymer matrix composites for space based cube satellites journal August 2017
Thermal conductivity of boron nitride reinforced polyethylene composites journal October 2007
Graphene-based thermoplastic composites and their application for LED thermal management journal June 2016
Thermal and mechanical properties of 3D printed boron nitride – ABS composites journal November 2017
Thermal Conductivity of Polymers journal December 1966
On the role of radiation view factor in thermal performance of straight-fin heat sinks journal October 2010
On the temperature dependence of the thermal conductivity of linear amorphous polymers journal January 1996