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Title: Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility

Abstract

The microstructure of printed Cu wirings fabricated from air-stable Cu complex inks is greatly modified by low-temperature curing followed by intense pulsed light densification enhancement treatment. The resulting almost full densification of printed Cu wirings enables them to possess a high electrical conductivity of 50% bulk Cu. The dense structure also largely prevents the permeation of oxygen and water into the inner side of the Cu wirings, thereby improving their oxidation resistance and maintaining a stable resistance (R/R0 < 1.5) even after 1000 h aging at 85 °C-85% RH. In addition, the dense and robust structure can improve the resistance to crack generation and propagation in Cu wirings during the bending, so as to improve their flexibility. The relative resistance of Cu wirings can be kept below 1.2 after 1000 bending cycles. All the results indicate that these highly densified Cu wirings fabricated from air-stable Cu complex inks can be used to replace the noble metallic Au and Ag wirings for practical application in flexible electronics.

Authors:
 [1]; ORCiD logo [2];  [1];  [1];  [1];  [1]
  1. Osaka University
  2. BATTELLE (PACIFIC NW LAB)
Publication Date:
Research Org.:
Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1557794
Report Number(s):
PNNL-SA-140723
DOE Contract Number:  
AC05-76RL01830
Resource Type:
Journal Article
Journal Name:
Advanced Materials Interfaces
Additional Journal Information:
Journal Volume: 5; Journal Issue: 19
Country of Publication:
United States
Language:
English

Citation Formats

Li, Wanli, Yang, Yang, Zhang, Bowen, Li, Cai-Fu, Jiu, Jinting, and Suganuma, Katsuaki. Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility. United States: N. p., 2018. Web. doi:10.1002/admi.201800798.
Li, Wanli, Yang, Yang, Zhang, Bowen, Li, Cai-Fu, Jiu, Jinting, & Suganuma, Katsuaki. Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility. United States. doi:10.1002/admi.201800798.
Li, Wanli, Yang, Yang, Zhang, Bowen, Li, Cai-Fu, Jiu, Jinting, and Suganuma, Katsuaki. Tue . "Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility". United States. doi:10.1002/admi.201800798.
@article{osti_1557794,
title = {Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility},
author = {Li, Wanli and Yang, Yang and Zhang, Bowen and Li, Cai-Fu and Jiu, Jinting and Suganuma, Katsuaki},
abstractNote = {The microstructure of printed Cu wirings fabricated from air-stable Cu complex inks is greatly modified by low-temperature curing followed by intense pulsed light densification enhancement treatment. The resulting almost full densification of printed Cu wirings enables them to possess a high electrical conductivity of 50% bulk Cu. The dense structure also largely prevents the permeation of oxygen and water into the inner side of the Cu wirings, thereby improving their oxidation resistance and maintaining a stable resistance (R/R0 < 1.5) even after 1000 h aging at 85 °C-85% RH. In addition, the dense and robust structure can improve the resistance to crack generation and propagation in Cu wirings during the bending, so as to improve their flexibility. The relative resistance of Cu wirings can be kept below 1.2 after 1000 bending cycles. All the results indicate that these highly densified Cu wirings fabricated from air-stable Cu complex inks can be used to replace the noble metallic Au and Ag wirings for practical application in flexible electronics.},
doi = {10.1002/admi.201800798},
journal = {Advanced Materials Interfaces},
number = 19,
volume = 5,
place = {United States},
year = {2018},
month = {10}
}