Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility

Li, Wanli; Yang, Yang; Zhang, Bowen; Li, Cai-Fu; Jiu, Jinting; Suganuma, Katsuaki

doi:10.1002/admi.201800798

Title: Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility

Journal Article · Tue Oct 09 00:00:00 EDT 2018 · Advanced Materials Interfaces

DOI:https://doi.org/10.1002/admi.201800798· OSTI ID:1557794

Li, Wanli ^[1];

^[2]; Zhang, Bowen ^[1]; Li, Cai-Fu ^[1]; Jiu, Jinting ^[1]; Suganuma, Katsuaki ^[1]

Osaka University
BATTELLE (PACIFIC NW LAB)

The microstructure of printed Cu wirings fabricated from air-stable Cu complex inks is greatly modified by low-temperature curing followed by intense pulsed light densification enhancement treatment. The resulting almost full densification of printed Cu wirings enables them to possess a high electrical conductivity of 50% bulk Cu. The dense structure also largely prevents the permeation of oxygen and water into the inner side of the Cu wirings, thereby improving their oxidation resistance and maintaining a stable resistance (R/R0 < 1.5) even after 1000 h aging at 85 °C-85% RH. In addition, the dense and robust structure can improve the resistance to crack generation and propagation in Cu wirings during the bending, so as to improve their flexibility. The relative resistance of Cu wirings can be kept below 1.2 after 1000 bending cycles. All the results indicate that these highly densified Cu wirings fabricated from air-stable Cu complex inks can be used to replace the noble metallic Au and Ag wirings for practical application in flexible electronics.

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Research Organization:: Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: AC05-76RL01830

OSTI ID:: 1557794

Report Number(s):: PNNL-SA-140723

Journal Information:: Advanced Materials Interfaces, Vol. 5, Issue 19

Country of Publication:: United States

Language:: English

References (42)

Inorganic nanomaterials for printed electronics: a review Wu, Wei Nanoscale, Vol. 9, Issue 22 https://doi.org/10.1039/C7NR01604B	journal	January 2017
Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials Perelaer, Jolke; Smith, Patrick J.; Mager, Dario Journal of Materials Chemistry, Vol. 20, Issue 39 https://doi.org/10.1039/c0jm00264j	journal	January 2010
Thermal cure effects on electrical performance of nanoparticle silver inks Greer, Julia R.; Street, Robert A. Acta Materialia, Vol. 55, Issue 18 https://doi.org/10.1016/j.actamat.2007.07.040	journal	October 2007
Homogeneous dewetting on large-scale microdroplet arrays for solution-processed electronics Liu, Xuying; Liu, Chuan; Sakamoto, Kenji NPG Asia Materials, Vol. 9, Issue 7 https://doi.org/10.1038/am.2017.123	journal	July 2017
Sintering of inkjet printed copper nanoparticles for flexible electronics Jang, Seonhee; Seo, Youngkwan; Choi, Joonrak Scripta Materialia, Vol. 62, Issue 5 https://doi.org/10.1016/j.scriptamat.2009.11.011	journal	March 2010
Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering Kwon, Young-Tae; Lee, Young-In; Kim, Seil Applied Surface Science, Vol. 396 https://doi.org/10.1016/j.apsusc.2016.11.122	journal	February 2017
Microstructure and electrical property of laser-sintered Cu complex ink Lee, Jeonghyeon; Lee, Byoungyoon; Jeong, Sooncheol Applied Surface Science, Vol. 307 https://doi.org/10.1016/j.apsusc.2014.03.127	journal	July 2014
Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers Farraj, Yousef; Layani, Michael; Yaverboim, Avi Advanced Materials Interfaces, Vol. 5, Issue 8 https://doi.org/10.1002/admi.201701285	journal	January 2018
Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity Rosen, Yitzchak; Grouchko, Michael; Magdassi, Shlomo Advanced Materials Interfaces, Vol. 2, Issue 3 https://doi.org/10.1002/admi.201400448	journal	December 2014
High-Concentration Synthesis of Sub-10-nm Copper Nanoparticles for Application to Conductive Nanoinks Hokita, Yuki; Kanzaki, Mai; Sugiyama, Tomonori ACS Applied Materials & Interfaces, Vol. 7, Issue 34 https://doi.org/10.1021/acsami.5b05542	journal	August 2015
Air-stable, surface-oxide free Cu nanoparticles for highly conductive Cu ink and their application to printed graphene transistors Jeong, Sunho; Lee, Su Hyeon; Jo, Yejin Journal of Materials Chemistry C, Vol. 1, Issue 15 https://doi.org/10.1039/c3tc00904a	journal	January 2013
Stable Aqueous Based Cu Nanoparticle Ink for Printing Well-Defined Highly Conductive Features on a Plastic Substrate Jeong, Sunho; Song, Hae Chun; Lee, Won Woo Langmuir, Vol. 27, Issue 6 https://doi.org/10.1021/la104136w	journal	March 2011
Oxidation behavior of copper nanoparticles at low temperature Yabuki, Akihiro; Tanaka, Shuji Materials Research Bulletin, Vol. 46, Issue 12 https://doi.org/10.1016/j.materresbull.2011.08.043	journal	December 2011
Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing Jeong, Sunho; Woo, Kyoohee; Kim, Dongjo Advanced Functional Materials, Vol. 18, Issue 5 https://doi.org/10.1002/adfm.200700902	journal	March 2008
A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics Shin, Dong-Hun; Woo, Seunghee; Yem, Hyesuk ACS Applied Materials & Interfaces, Vol. 6, Issue 5 https://doi.org/10.1021/am4036306	journal	February 2014
Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines Yabuki, Akihiro; Tanaka, Shuji Materials Research Bulletin, Vol. 47, Issue 12 https://doi.org/10.1016/j.materresbull.2012.08.052	journal	December 2012
Self-catalyzed copper–silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper–silver hybrid tracks at a low temperature below 100 °C Li, Wanli; Li, Cai-Fu; Lang, Fengpei Nanoscale, Vol. 10, Issue 11 https://doi.org/10.1039/C7NR09225C	journal	January 2018
Plasma-Induced Decomposition of Copper Complex Ink for the Formation of Highly Conductive Copper Tracks on Heat-Sensitive Substrates Farraj, Yousef; Smooha, Ariel; Kamyshny, Alexander ACS Applied Materials & Interfaces, Vol. 9, Issue 10 https://doi.org/10.1021/acsami.6b14462	journal	March 2017
Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink Choi, Yun-Hyuk; Hong, Seong-Hyeon Langmuir, Vol. 31, Issue 29 https://doi.org/10.1021/acs.langmuir.5b01207	journal	July 2015
Synergetic Effect of Blended Alkylamines for Copper Complex Ink To Form Conductive Copper Films Xu, Wen; Wang, Tao Langmuir, Vol. 33, Issue 1 https://doi.org/10.1021/acs.langmuir.6b03668	journal	December 2016
Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate Li, Wanli; Cong, Shuren; Jiu, Jinting Journal of Materials Chemistry C, Vol. 4, Issue 37 https://doi.org/10.1039/C6TC02914K	journal	January 2016
Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability Li, Wanli; Li, Lingying; Gao, Yue Journal of Alloys and Compounds, Vol. 732 https://doi.org/10.1016/j.jallcom.2017.10.193	journal	January 2018
Contribution of Ligand Oxidation Products to High Durability of Copper Films Prepared from Low-Sintering-Temperature Copper Ink on Polymer Substrates : Contribution of Ligand Oxidation Products… Akiyama, Yusuke; Sugiyama, Tomonori; Kawasaki, Hideya Advanced Engineering Materials, Vol. 19, Issue 8 https://doi.org/10.1002/adem.201700259	journal	May 2017
Ink-Jet Printing of Cu−Ag-Based Highly Conductive Tracks on a Transparent Substrate Woo, Kyoohee; Kim, Dongjo; Kim, Jang Sub Langmuir, Vol. 25, Issue 1 https://doi.org/10.1021/la802182y	journal	January 2009
Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres Gao, Yue; Zhang, Hao; Li, Wanli Journal of Electronic Materials, Vol. 46, Issue 7 https://doi.org/10.1007/s11664-017-5464-2	journal	March 2017
Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes Yu, Myeong-Hyeon; Joo, Sung-Jun; Kim, Hak-Sung Nanotechnology, Vol. 28, Issue 20 https://doi.org/10.1088/1361-6528/aa6cda	journal	April 2017
Copper interconnections and antennas fabricated by hot-pressing printed copper formate Rosen, Yitzchak S.; Lidor, Yuval; Balter, Revital Flexible and Printed Electronics, Vol. 2, Issue 3 https://doi.org/10.1088/2058-8585/aa89bb	journal	September 2017
Intense pulsed light for split-second structural development of nanomaterials Lim, Ho Sun; Kim, Soo Jin; Jang, Ho Won Journal of Materials Chemistry C, Vol. 5, Issue 29 https://doi.org/10.1039/C7TC01848G	journal	January 2017
Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light Yang, Yang; Ding, Su; Araki, Teppei Nano Research, Vol. 9, Issue 2 https://doi.org/10.1007/s12274-015-0921-9	journal	January 2016
Intense pulsed light sintering of copper nanoink for printed electronics Kim, Hak-Sung; Dhage, Sanjay R.; Shim, Dong-Eun Applied Physics A, Vol. 97, Issue 4 https://doi.org/10.1007/s00339-009-5360-6	journal	August 2009
A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique Joo, Sung-Jun; Park, Sung-Hyeon; Moon, Chang-Jin ACS Applied Materials & Interfaces, Vol. 7, Issue 10 https://doi.org/10.1021/am506765p	journal	March 2015
Photonic Sintering of Copper through the Controlled Reduction of Printed CuO Nanocrystals Paglia, Francesco; Vak, Doojin; van Embden, Joel ACS Applied Materials & Interfaces, Vol. 7, Issue 45 https://doi.org/10.1021/acsami.5b08430	journal	November 2015
The effect of poly (N-vinylpyrrolidone) molecular weight on flash light sintering of copper nanopaste Kim, Yoon-Jin; Ryu, Chung-Hyeon; Park, Sung-Hyeon Thin Solid Films, Vol. 570 https://doi.org/10.1016/j.tsf.2014.09.035	journal	November 2014
Multi-pulsed white light sintering of printed Cu nanoinks Han, Won-Suk; Hong, Jae-Min; Kim, Hak-Sung Nanotechnology, Vol. 22, Issue 39 https://doi.org/10.1088/0957-4484/22/39/395705	journal	September 2011
Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering Araki, Teppei; Sugahara, Tohru; Jiu, Jinting Langmuir, Vol. 29, Issue 35 https://doi.org/10.1021/la402026r	journal	August 2013
Cu Ion Ink for a Flexible Substrate and Highly Conductive Patterning by Intensive Pulsed Light Sintering Wang, Byung-Yong; Yoo, Tae-Hee; Song, Yong-Won ACS Applied Materials & Interfaces, Vol. 5, Issue 10 https://doi.org/10.1021/am303268k	journal	April 2013
Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics Farraj, Yousef; Grouchko, Michael; Magdassi, Shlomo Chemical Communications, Vol. 51, Issue 9 https://doi.org/10.1039/C4CC08749F	journal	January 2015
On the self-damping nature of densification in photonic sintering of nanoparticles MacNeill, William; Choi, Chang-Ho; Chang, Chih-Hung Scientific Reports, Vol. 5, Issue 1 https://doi.org/10.1038/srep14845	journal	October 2015
Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate Jeon, Eun-Beom; Joo, Sung-Jun; Ahn, Heejoon Thin Solid Films, Vol. 603 https://doi.org/10.1016/j.tsf.2016.02.033	journal	March 2016
New model for low-temperature oxidation of copper single crystal Fujita, Kensuke; Ando, Daisuke; Uchikoshi, Masahito Applied Surface Science, Vol. 276 https://doi.org/10.1016/j.apsusc.2013.03.096	journal	July 2013
Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement Li, Wanli; Zhang, Hao; Gao, Yue Journal of Materials Chemistry C, Vol. 5, Issue 5 https://doi.org/10.1039/C6TC04892G	journal	January 2017
Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate Wu, Xinzhou; Shao, Shuangshuang; Chen, Zheng Nanotechnology, Vol. 28, Issue 3 https://doi.org/10.1088/1361-6528/28/3/035203	journal	December 2016

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