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Title: Fast Timing with Induced Current Detectors

Abstract

Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, ne pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, en- abled by the ne pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. We describe the capabilities of such a system and the limitations imposed by geometry and power. We describe how a similar geometry can be used to provide very fast timing of x-ray arrival in a thick sensor by utilizing the transient induced current in a eld of pixels.

Authors:
 [1];  [2]
  1. Fermilab
  2. Purdue U.
Publication Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Org.:
USDOE Office of Science (SC), High Energy Physics (HEP) (SC-25)
OSTI Identifier:
1556958
Report Number(s):
FERMILAB-CONF-18-628-CMS-E-PPD
Journal ID: ISSN 0168-9002; 1747879
DOE Contract Number:  
AC02-07CH11359
Resource Type:
Conference
Country of Publication:
United States
Language:
English
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY

Citation Formats

Lipton, Ronald, and Theiman, Jason. Fast Timing with Induced Current Detectors. United States: N. p., 2019. Web. doi:10.1016/j.nima.2019.162423.
Lipton, Ronald, & Theiman, Jason. Fast Timing with Induced Current Detectors. United States. doi:10.1016/j.nima.2019.162423.
Lipton, Ronald, and Theiman, Jason. Mon . "Fast Timing with Induced Current Detectors". United States. doi:10.1016/j.nima.2019.162423. https://www.osti.gov/servlets/purl/1556958.
@article{osti_1556958,
title = {Fast Timing with Induced Current Detectors},
author = {Lipton, Ronald and Theiman, Jason},
abstractNote = {Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, ne pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, en- abled by the ne pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. We describe the capabilities of such a system and the limitations imposed by geometry and power. We describe how a similar geometry can be used to provide very fast timing of x-ray arrival in a thick sensor by utilizing the transient induced current in a eld of pixels.},
doi = {10.1016/j.nima.2019.162423},
journal = {},
issn = {0168-9002},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {7}
}

Conference:
Other availability
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