Pressed copper and gold-plated copper contacts at low temperatures – A review of thermal contact resistance

Dhuley, R. C.

doi:10.1016/j.cryogenics.2019.06.008

Title: Pressed copper and gold-plated copper contacts at low temperatures – A review of thermal contact resistance

Journal Article · Fri Jun 21 00:00:00 EDT 2019 · Cryogenics

DOI:https://doi.org/10.1016/j.cryogenics.2019.06.008· OSTI ID:1542958

Dhuley, R. C. ^[1]

Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)

Cryogenic systems that utilize cryocoolers with conduction cooling for attaining temperatures of 4.2 K and below routinely employ mechanically pressed components of copper to form the heat conduction path. To help with the design of such systems, the present paper introduces thermal contact resistance data of pressed copper-copper and gold-plated copper-copper contacts from nearly twenty measurement programs that span across past fifty years. Relevant theoretical models of thermal contact resistance are briefly reviewed and compared with the experimental data. Gold-plated copper contacts display reasonable trend with the models, which may serve as a design reference for such contacts. A few measurement techniques are also summarized that enable quick characterization of thermal contacts at low temperatures.

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Research Organization:: Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)

Sponsoring Organization:: USDOE Office of Science (SC), High Energy Physics (HEP)

Grant/Contract Number:: AC02-07CH11359

OSTI ID:: 1542958

Alternate ID(s):: OSTI ID: 1702308

Report Number(s):: FERMILAB-PUB-19-134-TD; 1742585

Journal Information:: Cryogenics, Vol. 101, Issue C; ISSN 0011-2275

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 16 works

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