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Title: Results from the CBC3 readout ASIC for CMS 2S-modules

Abstract

The CBC3 is the latest version of the CMS Binary Chip for readout of the outer radial region of the upgraded CMS Tracker at the High Luminosity LHC. This 254-channel, 130 nm CMOS ASIC is designed to be bump-bonded to a substrate to which sensors will be wire-bonded. It will instrument double-layer 2S-modules, containing two overlaid silicon microstrip sensors, aligned with a parallel orientation. On-chip logic identifies Level-1 trigger primitives from high transverse-momentum tracks by selecting correlated clusters in the two sensors. The CBC3 was delivered in late 2016; wafer probing and performance tests have been carried out. Several prototype modules using the CBC3 have been produced and tested in the lab and in different beams. The results show that the CBC3 satisfies CMS requirements and only small corrections are needed for the final version of the chip for production.

Authors:
 [1];  [1];  [2];  [1];  [3];  [4];  [1];  [2];  [2];  [2];  [4];  [1];  [2];  [1]
  1. Imperial College, London (United Kingdom). Blackett Lab.
  2. Science and Technology Facilities Council (STFC), Didcot (United Kingdom). Rutherford Appleton Lab. (RAL)
  3. Science and Technology Facilities Council (STFC), Didcot (United Kingdom). Rutherford Appleton Lab. (RAL); Imperial College, London (United Kingdom). Blackett Lab.; Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
  4. Univ. of Bristol (United Kingdom). HH Wills Physics Lab.
Publication Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States); Science and Technology Facilities Council (STFC), Didcot (United Kingdom)
Sponsoring Org.:
USDOE; Science and Technology Facilities Council (STFC) (United Kingdom)
OSTI Identifier:
1542175
Report Number(s):
FERMILAB-PUB-18-776-PPD
Journal ID: ISSN 0168-9002; 1727111
Grant/Contract Number:  
AC02-07CH11359
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Nuclear Instruments and Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment
Additional Journal Information:
Journal Volume: 924; Journal ID: ISSN 0168-9002
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; ASIC electronics; tracking detectors; silicon microstrips; trigger; HL-LHC

Citation Formats

Uchida, K., Auzinger, G., Bell, S. J., Borg, J., Braga, D., Goldstein, J., Hall, G., Jones, L., Key-Charriere, M., Murray, P., El Nasr, S. Seif, Pesaresi, M., Prydderch, M. L., and Raymond, M. Results from the CBC3 readout ASIC for CMS 2S-modules. United States: N. p., 2018. Web. doi:10.1016/j.nima.2018.09.051.
Uchida, K., Auzinger, G., Bell, S. J., Borg, J., Braga, D., Goldstein, J., Hall, G., Jones, L., Key-Charriere, M., Murray, P., El Nasr, S. Seif, Pesaresi, M., Prydderch, M. L., & Raymond, M. Results from the CBC3 readout ASIC for CMS 2S-modules. United States. doi:10.1016/j.nima.2018.09.051.
Uchida, K., Auzinger, G., Bell, S. J., Borg, J., Braga, D., Goldstein, J., Hall, G., Jones, L., Key-Charriere, M., Murray, P., El Nasr, S. Seif, Pesaresi, M., Prydderch, M. L., and Raymond, M. Mon . "Results from the CBC3 readout ASIC for CMS 2S-modules". United States. doi:10.1016/j.nima.2018.09.051. https://www.osti.gov/servlets/purl/1542175.
@article{osti_1542175,
title = {Results from the CBC3 readout ASIC for CMS 2S-modules},
author = {Uchida, K. and Auzinger, G. and Bell, S. J. and Borg, J. and Braga, D. and Goldstein, J. and Hall, G. and Jones, L. and Key-Charriere, M. and Murray, P. and El Nasr, S. Seif and Pesaresi, M. and Prydderch, M. L. and Raymond, M.},
abstractNote = {The CBC3 is the latest version of the CMS Binary Chip for readout of the outer radial region of the upgraded CMS Tracker at the High Luminosity LHC. This 254-channel, 130 nm CMOS ASIC is designed to be bump-bonded to a substrate to which sensors will be wire-bonded. It will instrument double-layer 2S-modules, containing two overlaid silicon microstrip sensors, aligned with a parallel orientation. On-chip logic identifies Level-1 trigger primitives from high transverse-momentum tracks by selecting correlated clusters in the two sensors. The CBC3 was delivered in late 2016; wafer probing and performance tests have been carried out. Several prototype modules using the CBC3 have been produced and tested in the lab and in different beams. The results show that the CBC3 satisfies CMS requirements and only small corrections are needed for the final version of the chip for production.},
doi = {10.1016/j.nima.2018.09.051},
journal = {Nuclear Instruments and Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment},
issn = {0168-9002},
number = ,
volume = 924,
place = {United States},
year = {2018},
month = {10}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Figures / Tables:

Fig. 1 Fig. 1: CBC3 architecture.

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