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Title: Pitch and aspect ratio effects on single-phase heat transfer through microscale pin fin heat sinks

Abstract

Not provided.

Authors:
ORCiD logo; ORCiD logo;
Publication Date:
Research Org.:
Oregon State Univ., Corvallis, OR (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1538345
DOE Contract Number:  
EE0007108; FE0024064
Resource Type:
Journal Article
Journal Name:
International Journal of Heat and Mass Transfer
Additional Journal Information:
Journal Volume: 118; Journal Issue: C; Journal ID: ISSN 0017-9310
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
Thermodynamics; Engineering; Mechanics

Citation Formats

Rasouli, Erfan, Naderi, Cameron, and Narayanan, Vinod. Pitch and aspect ratio effects on single-phase heat transfer through microscale pin fin heat sinks. United States: N. p., 2018. Web. doi:10.1016/j.ijheatmasstransfer.2017.10.105.
Rasouli, Erfan, Naderi, Cameron, & Narayanan, Vinod. Pitch and aspect ratio effects on single-phase heat transfer through microscale pin fin heat sinks. United States. https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.105
Rasouli, Erfan, Naderi, Cameron, and Narayanan, Vinod. 2018. "Pitch and aspect ratio effects on single-phase heat transfer through microscale pin fin heat sinks". United States. https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.105.
@article{osti_1538345,
title = {Pitch and aspect ratio effects on single-phase heat transfer through microscale pin fin heat sinks},
author = {Rasouli, Erfan and Naderi, Cameron and Narayanan, Vinod},
abstractNote = {Not provided.},
doi = {10.1016/j.ijheatmasstransfer.2017.10.105},
url = {https://www.osti.gov/biblio/1538345}, journal = {International Journal of Heat and Mass Transfer},
issn = {0017-9310},
number = C,
volume = 118,
place = {United States},
year = {Thu Mar 01 00:00:00 EST 2018},
month = {Thu Mar 01 00:00:00 EST 2018}
}

Works referenced in this record:

Single-Phase Cryogenic Flow and Heat Transfer Through Microscale Pin Fin Heat Sinks
journal, January 2016


Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micropin-Fins Under Cross Flow for Water as Fluid
journal, April 2006


Interlayer cooling potential in vertically integrated packages
journal, August 2008


High-performance heat sinking for VLSI
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Forced convective heat transfer across a pin fin micro heat sink
journal, August 2005


Laminar Flow Across a Bank of Low Aspect Ratio Micro Pin Fins
journal, March 2005


Convective flow of refrigerant (R-123) across a bank of micro pin fins
journal, August 2006


TCPT-2006-096.R2: Micro Scale pin fin Heat Sinks —Parametric Performance Evaluation Study
journal, December 2007


Performance of Pin Fin Cast Aluminum Coldwalls, Part 1: Friction Factor Correlations
journal, July 2002


Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics
journal, April 2011


Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
journal, October 2013


Describing the uncertainties in experimental results
journal, January 1988


Vortex shedding from confined micropin arrays
journal, January 2013


Liquid Single-Phase Flow in an Array of Micro-Pin-Fins—Part I: Heat Transfer Characteristics
journal, September 2008


Performance of Pin Fin Cast Aluminum Coldwalls, Part 2: Colburn j-Factor Correlations
journal, July 2002


A Generalized Critical Heat Flux Correlation for Submerged and Free Surface Jet Impingement Boiling
journal, May 2014


Works referencing / citing this record:

Parametric Investigation on a Micro-Array Heat Sink with Staggered Trapezoidal Bumps
journal, December 2019