Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes

Ahmad, Zeeshan; Viswanathan, Venkatasubramanian

doi:10.1103/physrevlett.119.056003

Title: Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes

Journal Article · Fri Aug 04 00:00:00 EDT 2017 · Physical Review Letters

DOI:https://doi.org/10.1103/physrevlett.119.056003· OSTI ID:1881504

Ahmad, Zeeshan ^[1]; Viswanathan, Venkatasubramanian ^[1]

Carnegie Mellon Univ., Pittsburgh, PA (United States)

We generalize the conditions for stable electrodeposition at isotropic solid-solid interfaces using a kinetic model which incorporates the effects of stresses and surface tension at the interface. We develop a stability diagram that shows two regimes of stability: a previously known pressure-driven mechanism and a new density-driven stability mechanism that is governed by the relative density of metal in the two phases. We show that inorganic solids and solid polymers generally do not lead to stable electrodeposition, and provide design guidelines for achieving stable electrodeposition.

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Research Organization:: Carnegie Mellon Univ., Pittsburgh, PA (United States); 24M Technologies, Inc., Cambridge, MA (United States); Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)

Sponsoring Organization:: USDOE Advanced Research Projects Agency - Energy (ARPA-E); USDOE Office of Energy Efficiency and Renewable Energy (EERE), Transportation Office. Vehicle Technologies Office

Grant/Contract Number:: AR0000774; EE0007810

OSTI ID:: 1881504

Alternate ID(s):: OSTI ID: 1374071; OSTI ID: 1536538

Journal Information:: Physical Review Letters, Vol. 119, Issue 5; ISSN 0031-9007

Publisher:: American Physical Society (APS)Copyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 106 works

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