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Title: Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys

Abstract

Not provided.

Authors:
; ; ; ;
Publication Date:
Research Org.:
Univ. of Pennsylvania, Philadelphia, PA (United States)
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
1534292
DOE Contract Number:  
SC0008135
Resource Type:
Journal Article
Journal Name:
Scripta Materialia
Additional Journal Information:
Journal Volume: 123; Journal Issue: C; Journal ID: ISSN 1359-6462
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
Science & Technology - Other Topics; Materials Science; Metallurgy & Metallurgical Engineering

Citation Formats

Kim, Gyuseok, Chai, Xuzhao, Yu, Le, Cheng, Xuemei, and Gianola, Daniel S. Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys. United States: N. p., 2016. Web. doi:10.1016/j.scriptamat.2016.06.008.
Kim, Gyuseok, Chai, Xuzhao, Yu, Le, Cheng, Xuemei, & Gianola, Daniel S. Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys. United States. doi:10.1016/j.scriptamat.2016.06.008.
Kim, Gyuseok, Chai, Xuzhao, Yu, Le, Cheng, Xuemei, and Gianola, Daniel S. Sat . "Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys". United States. doi:10.1016/j.scriptamat.2016.06.008.
@article{osti_1534292,
title = {Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys},
author = {Kim, Gyuseok and Chai, Xuzhao and Yu, Le and Cheng, Xuemei and Gianola, Daniel S.},
abstractNote = {Not provided.},
doi = {10.1016/j.scriptamat.2016.06.008},
journal = {Scripta Materialia},
issn = {1359-6462},
number = C,
volume = 123,
place = {United States},
year = {2016},
month = {10}
}