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Title: Origins of residual stress in thin films: Interaction between microstructure and growth kinetics

Abstract

Not provided.

Authors:
; ;
Publication Date:
Research Org.:
Brown Univ., Providence, RI (United States)
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
1534078
DOE Contract Number:  
SC0008799
Resource Type:
Journal Article
Journal Name:
Materials & Design
Additional Journal Information:
Journal Volume: 110; Journal Issue: C; Journal ID: ISSN 0264-1275
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
Materials Science

Citation Formats

Engwall, A. M., Rao, Z., and Chason, E. Origins of residual stress in thin films: Interaction between microstructure and growth kinetics. United States: N. p., 2016. Web. doi:10.1016/j.matdes.2016.07.089.
Engwall, A. M., Rao, Z., & Chason, E. Origins of residual stress in thin films: Interaction between microstructure and growth kinetics. United States. doi:10.1016/j.matdes.2016.07.089.
Engwall, A. M., Rao, Z., and Chason, E. Tue . "Origins of residual stress in thin films: Interaction between microstructure and growth kinetics". United States. doi:10.1016/j.matdes.2016.07.089.
@article{osti_1534078,
title = {Origins of residual stress in thin films: Interaction between microstructure and growth kinetics},
author = {Engwall, A. M. and Rao, Z. and Chason, E.},
abstractNote = {Not provided.},
doi = {10.1016/j.matdes.2016.07.089},
journal = {Materials & Design},
issn = {0264-1275},
number = C,
volume = 110,
place = {United States},
year = {2016},
month = {11}
}