In-Plane Deformation Mechanics for Highly Stretchable Electronics
Abstract
Not provided.
- Authors:
-
more »
- State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190 China; Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston IL 60208 USA; School of Engineering Science, University of Chinese Academy of Sciences, Beijing 100049 China; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024 China
- School of Mechanical Engineering, Tianjin University of Science & Technology, Tianjin 300222 China
- Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign IL 61820 USA
- Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign IL 61820 USA; Department of Material Science and Engineering Department of Energy Engineering, Hanyang University, Seoul 133-791 South Korea
- Department of Electrical Engineering, Stanford University, Stanford CA 94305 USA
- School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater OK 74078 USA
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024 China
- Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston IL 60208 USA; State Key Lab Digital Manufacturing Equipment and Technology and Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan Hubei 430074 China
- Department of Mechanical Engineering, University of Houston, Houston TX 77204 USA
- Department of Material Science and Engineering Department of Energy Engineering, Hanyang University, Seoul 133-791 South Korea
- Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston IL 60208 USA
- Department of Electrical and Computer Engineering and the Department of Chemistry Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Champaign, Urbana IL 61820 USA
- Publication Date:
- Research Org.:
- Univ. of Maryland, College Park, MD (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC)
- OSTI Identifier:
- 1533033
- DOE Contract Number:
- SC0005436
- Resource Type:
- Journal Article
- Journal Name:
- Advanced Materials
- Additional Journal Information:
- Journal Volume: 29; Journal Issue: 8; Journal ID: ISSN 0935-9648
- Publisher:
- Wiley
- Country of Publication:
- United States
- Language:
- English
- Subject:
- Chemistry; Science & Technology - Other Topics; Materials Science; Physics
Citation Formats
Su, Yewang, Ping, Xuecheng, Yu, Ki Jun, Lee, Jung Woo, Fan, Jonathan A., Wang, Bo, Li, Ming, Li, Rui, Harburg, Daniel V., Huang, YongAn, Yu, Cunjiang, Mao, Shimin, Shim, Jaehoun, Yang, Qinglin, Lee, Pei-Yin, Armonas, Agne, Choi, Ki-Joong, Yang, Yichen, Paik, Ungyu, Chang, Tammy, Dawidczyk, Thomas J., Huang, Yonggang, Wang, Shuodao, and Rogers, John A. In-Plane Deformation Mechanics for Highly Stretchable Electronics. United States: N. p., 2016.
Web. doi:10.1002/adma.201604989.
Su, Yewang, Ping, Xuecheng, Yu, Ki Jun, Lee, Jung Woo, Fan, Jonathan A., Wang, Bo, Li, Ming, Li, Rui, Harburg, Daniel V., Huang, YongAn, Yu, Cunjiang, Mao, Shimin, Shim, Jaehoun, Yang, Qinglin, Lee, Pei-Yin, Armonas, Agne, Choi, Ki-Joong, Yang, Yichen, Paik, Ungyu, Chang, Tammy, Dawidczyk, Thomas J., Huang, Yonggang, Wang, Shuodao, & Rogers, John A. In-Plane Deformation Mechanics for Highly Stretchable Electronics. United States. doi:10.1002/adma.201604989.
Su, Yewang, Ping, Xuecheng, Yu, Ki Jun, Lee, Jung Woo, Fan, Jonathan A., Wang, Bo, Li, Ming, Li, Rui, Harburg, Daniel V., Huang, YongAn, Yu, Cunjiang, Mao, Shimin, Shim, Jaehoun, Yang, Qinglin, Lee, Pei-Yin, Armonas, Agne, Choi, Ki-Joong, Yang, Yichen, Paik, Ungyu, Chang, Tammy, Dawidczyk, Thomas J., Huang, Yonggang, Wang, Shuodao, and Rogers, John A. Thu .
"In-Plane Deformation Mechanics for Highly Stretchable Electronics". United States. doi:10.1002/adma.201604989.
@article{osti_1533033,
title = {In-Plane Deformation Mechanics for Highly Stretchable Electronics},
author = {Su, Yewang and Ping, Xuecheng and Yu, Ki Jun and Lee, Jung Woo and Fan, Jonathan A. and Wang, Bo and Li, Ming and Li, Rui and Harburg, Daniel V. and Huang, YongAn and Yu, Cunjiang and Mao, Shimin and Shim, Jaehoun and Yang, Qinglin and Lee, Pei-Yin and Armonas, Agne and Choi, Ki-Joong and Yang, Yichen and Paik, Ungyu and Chang, Tammy and Dawidczyk, Thomas J. and Huang, Yonggang and Wang, Shuodao and Rogers, John A.},
abstractNote = {Not provided.},
doi = {10.1002/adma.201604989},
journal = {Advanced Materials},
issn = {0935-9648},
number = 8,
volume = 29,
place = {United States},
year = {2016},
month = {12}
}
Other availability
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Materials for stretchable electronics in bioinspired and biointegrated devices
journal, March 2012
- Kim, Dae-Hyeong; Lu, Nanshu; Huang, Yonggang
- MRS Bulletin, Vol. 37, Issue 3
A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications
journal, June 2004
- Someya, T.; Sekitani, T.; Iba, S.
- Proceedings of the National Academy of Sciences, Vol. 101, Issue 27, p. 9966-9970
Transparent, Optical, Pressure-Sensitive Artificial Skin for Large-Area Stretchable Electronics
journal, May 2012
- Ramuz, Marc; Tee, Benjamin C-K.; Tok, Jeffrey B.-H.
- Advanced Materials, Vol. 24, Issue 24, p. 3223-3227
Stretchable GaAs Photovoltaics with Designs That Enable High Areal Coverage
journal, January 2011
- Lee, Jongho; Wu, Jian; Shi, Mingxing
- Advanced Materials, Vol. 23, Issue 8
Stretchable, elastic materials and devices for solar energy conversion
journal, January 2011
- Lipomi, Darren J.; Bao, Zhenan
- Energy & Environmental Science, Vol. 4, Issue 9
Flexible Technologies and Smart Clothing for Citizen Medicine, Home Healthcare, and Disease Prevention
journal, September 2005
- Axisa, F.; Schmitt, P. M.; Gehin, C.
- IEEE Transactions on Information Technology in Biomedicine, Vol. 9, Issue 3
Printed Assemblies of Inorganic Light-Emitting Diodes for Deformable and Semitransparent Displays
journal, August 2009
- Park, S.-I.; Xiong, Y.; Kim, R.-H.
- Science, Vol. 325, Issue 5943, p. 977-981
Stretchable and Foldable Silicon Integrated Circuits
journal, April 2008
- Kim, D.-H.; Ahn, J.-H.; Choi, W. M.
- Science, Vol. 320, Issue 5875, p. 507-511
Ultrathin, highly flexible and stretchable PLEDs
journal, July 2013
- White, Matthew S.; Kaltenbrunner, Martin; Głowacki, Eric D.
- Nature Photonics, Vol. 7, Issue 10
Epidermal Electronics
journal, August 2011
- Kim, D.-H.; Lu, N.; Ma, R.
- Science, Vol. 333, Issue 6044, p. 838-843
A Conformal, Bio-Interfaced Class of Silicon Electronics for Mapping Cardiac Electrophysiology
journal, March 2010
- Viventi, J.; Kim, D.-H.; Moss, J. D.
- Science Translational Medicine, Vol. 2, Issue 24, p. 24ra22-24ra22
A hemispherical electronic eye camera based on compressible silicon optoelectronics
journal, August 2008
- Ko, Heung Cho; Stoykovich, Mark P.; Song, Jizhou
- Nature, Vol. 454, Issue 7205, p. 748-753
Digital cameras with designs inspired by the arthropod eye
journal, May 2013
- Song, Young Min; Xie, Yizhu; Malyarchuk, Viktor
- Nature, Vol. 497, Issue 7447
Experimental and Theoretical Studies of Serpentine Microstructures Bonded To Prestrained Elastomers for Stretchable Electronics
journal, November 2013
- Zhang, Yihui; Wang, Shuodao; Li, Xuetong
- Advanced Functional Materials, Vol. 24, Issue 14
Postbuckling analysis and its application to stretchable electronics
journal, March 2012
- Su, Yewang; Wu, Jian; Fan, Zhichao
- Journal of the Mechanics and Physics of Solids, Vol. 60, Issue 3, p. 487-508
Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations
journal, November 2008
- Kim, D.-H.; Song, J.; Choi, W. M.
- Proceedings of the National Academy of Sciences, Vol. 105, Issue 48, p. 18675-18680
Soft Core/Shell Packages for Stretchable Electronics
journal, May 2015
- Lee, Chi Hwan; Ma, Yinji; Jang, Kyung-In
- Advanced Functional Materials, Vol. 25, Issue 24
Soft Microfluidic Assemblies of Sensors, Circuits, and Radios for the Skin
journal, April 2014
- Xu, Sheng; Zhang, Yihui; Jia, Lin
- Science, Vol. 344, Issue 6179
Stretchable batteries with self-similar serpentine interconnects and integrated wireless recharging systems
journal, February 2013
- Xu, Sheng; Zhang, Yihui; Cho, Jiung
- Nature Communications, Vol. 4, Issue 1
Elasticity of Fractal Inspired Interconnects
journal, September 2014
- Su, Yewang; Wang, Shuodao; Huang, YongAn
- Small, Vol. 11, Issue 3
Design of micro-scale highly expandable networks of polymer-based substrates for macro-scale applications
journal, March 2010
- Lanzara, G.; Feng, J.; Chang, F-K
- Smart Materials and Structures, Vol. 19, Issue 4
A Spider-Web-Like Highly Expandable Sensor Network for Multifunctional Materials
journal, September 2010
- Lanzara, Giulia; Salowitz, Nathan; Guo, Zhiqiang
- Advanced Materials, Vol. 22, Issue 41
High-Conductivity Elastomeric Electronics
journal, March 2004
- Gray, D. S.; Tien, J.; Chen, C. S.
- Advanced Materials, Vol. 16, Issue 5, p. 393-397
A Stretchable Form of Single-Crystal Silicon for High-Performance Electronics on Rubber Substrates
journal, January 2006
- Khang, Dahl-Young; Jiang, Hanqing; Huang, Young
- Science, Vol. 311, Issue 5758, p. 208-212
Finite deformation mechanics in buckled thin films on compliant supports
journal, September 2007
- Jiang, H.; Khang, D.-Y.; Song, J.
- Proceedings of the National Academy of Sciences, Vol. 104, Issue 40, p. 15607-15612
Indium Tin Oxide (ITO) serpentine ribbons on soft substrates stretched beyond 100%
journal, March 2015
- Yang, Shixuan; Ng, Eley; Lu, Nanshu
- Extreme Mechanics Letters, Vol. 2
Laser micromachining for mould manufacturing: I. The influence of operating parameters
journal, July 2006
- Bartolo, Paulo; Vasco, Joel; Silva, Bruno
- Assembly Automation, Vol. 26, Issue 3
Stretchable, Transparent Graphene Interconnects for Arrays of Microscale Inorganic Light Emitting Diodes on Rubber Substrates
journal, September 2011
- Kim, Rak-Hwan; Bae, Myung-Ho; Kim, Dae Gon
- Nano Letters, Vol. 11, Issue 9, p. 3881-3886
Screen printing of stretchable electrodes for large area LED matrix
journal, August 2015
- Ho, Xinning; Cheng, Chek Kweng; Tan, Rachel Lee Siew
- Journal of Materials Research, Vol. 30, Issue 15
Stretchable Semiconductor Technologies with High Areal Coverages and Strain-Limiting Behavior: Demonstration in High-Efficiency Dual-Junction GaInP/GaAs Photovoltaics
journal, March 2012
- Lee, Jongho; Wu, Jian; Ryu, Jae Ha
- Small, Vol. 8, Issue 12
Recent Advances in Flexible and Stretchable Bio-Electronic Devices Integrated with Nanomaterials
journal, January 2016
- Choi, Suji; Lee, Hyunjae; Ghaffari, Roozbeh
- Advanced Materials, Vol. 28, Issue 22
Metal/Polymer Based Stretchable Antenna for Constant Frequency Far-Field Communication in Wearable Electronics
journal, October 2015
- Hussain, Aftab M.; Ghaffar, Farhan A.; Park, Sung I.
- Advanced Functional Materials, Vol. 25, Issue 42