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Title: In-Plane Deformation Mechanics for Highly Stretchable Electronics

Abstract

Not provided.

Authors:
 [1];  [2];  [3];  [4];  [5];  [6];  [7];  [7];  [3];  [8];  [9];  [3];  [3];  [3];  [3];  [3];  [3];  [3];  [10];  [5] more »;  [3];  [11];  [6];  [12] « less
  1. State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190 China; Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston IL 60208 USA; School of Engineering Science, University of Chinese Academy of Sciences, Beijing 100049 China; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024 China
  2. School of Mechanical Engineering, Tianjin University of Science & Technology, Tianjin 300222 China
  3. Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign IL 61820 USA
  4. Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign IL 61820 USA; Department of Material Science and Engineering Department of Energy Engineering, Hanyang University, Seoul 133-791 South Korea
  5. Department of Electrical Engineering, Stanford University, Stanford CA 94305 USA
  6. School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater OK 74078 USA
  7. State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024 China
  8. Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston IL 60208 USA; State Key Lab Digital Manufacturing Equipment and Technology and Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan Hubei 430074 China
  9. Department of Mechanical Engineering, University of Houston, Houston TX 77204 USA
  10. Department of Material Science and Engineering Department of Energy Engineering, Hanyang University, Seoul 133-791 South Korea
  11. Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston IL 60208 USA
  12. Department of Electrical and Computer Engineering and the Department of Chemistry Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Champaign, Urbana IL 61820 USA
Publication Date:
Research Org.:
Univ. of Maryland, College Park, MD (United States)
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
1533033
DOE Contract Number:  
SC0005436
Resource Type:
Journal Article
Journal Name:
Advanced Materials
Additional Journal Information:
Journal Volume: 29; Journal Issue: 8; Journal ID: ISSN 0935-9648
Publisher:
Wiley
Country of Publication:
United States
Language:
English
Subject:
Chemistry; Science & Technology - Other Topics; Materials Science; Physics

Citation Formats

Su, Yewang, Ping, Xuecheng, Yu, Ki Jun, Lee, Jung Woo, Fan, Jonathan A., Wang, Bo, Li, Ming, Li, Rui, Harburg, Daniel V., Huang, YongAn, Yu, Cunjiang, Mao, Shimin, Shim, Jaehoun, Yang, Qinglin, Lee, Pei-Yin, Armonas, Agne, Choi, Ki-Joong, Yang, Yichen, Paik, Ungyu, Chang, Tammy, Dawidczyk, Thomas J., Huang, Yonggang, Wang, Shuodao, and Rogers, John A. In-Plane Deformation Mechanics for Highly Stretchable Electronics. United States: N. p., 2016. Web. doi:10.1002/adma.201604989.
Su, Yewang, Ping, Xuecheng, Yu, Ki Jun, Lee, Jung Woo, Fan, Jonathan A., Wang, Bo, Li, Ming, Li, Rui, Harburg, Daniel V., Huang, YongAn, Yu, Cunjiang, Mao, Shimin, Shim, Jaehoun, Yang, Qinglin, Lee, Pei-Yin, Armonas, Agne, Choi, Ki-Joong, Yang, Yichen, Paik, Ungyu, Chang, Tammy, Dawidczyk, Thomas J., Huang, Yonggang, Wang, Shuodao, & Rogers, John A. In-Plane Deformation Mechanics for Highly Stretchable Electronics. United States. doi:10.1002/adma.201604989.
Su, Yewang, Ping, Xuecheng, Yu, Ki Jun, Lee, Jung Woo, Fan, Jonathan A., Wang, Bo, Li, Ming, Li, Rui, Harburg, Daniel V., Huang, YongAn, Yu, Cunjiang, Mao, Shimin, Shim, Jaehoun, Yang, Qinglin, Lee, Pei-Yin, Armonas, Agne, Choi, Ki-Joong, Yang, Yichen, Paik, Ungyu, Chang, Tammy, Dawidczyk, Thomas J., Huang, Yonggang, Wang, Shuodao, and Rogers, John A. Thu . "In-Plane Deformation Mechanics for Highly Stretchable Electronics". United States. doi:10.1002/adma.201604989.
@article{osti_1533033,
title = {In-Plane Deformation Mechanics for Highly Stretchable Electronics},
author = {Su, Yewang and Ping, Xuecheng and Yu, Ki Jun and Lee, Jung Woo and Fan, Jonathan A. and Wang, Bo and Li, Ming and Li, Rui and Harburg, Daniel V. and Huang, YongAn and Yu, Cunjiang and Mao, Shimin and Shim, Jaehoun and Yang, Qinglin and Lee, Pei-Yin and Armonas, Agne and Choi, Ki-Joong and Yang, Yichen and Paik, Ungyu and Chang, Tammy and Dawidczyk, Thomas J. and Huang, Yonggang and Wang, Shuodao and Rogers, John A.},
abstractNote = {Not provided.},
doi = {10.1002/adma.201604989},
journal = {Advanced Materials},
issn = {0935-9648},
number = 8,
volume = 29,
place = {United States},
year = {2016},
month = {12}
}

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