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Title: Methods and devices for fabricating and assembling printable semiconductor elements

Patent ·
OSTI ID:1531946
; ; ; ; ; ; ;

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Research Organization:
Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FG02-91ER45439
Assignee:
The Board of Trustees of the University of Illinois (Urbana, IL)
Patent Number(s):
9,450,043
Application Number:
14/155,010
OSTI ID:
1531946
Resource Relation:
Patent File Date: 2014-01-14
Country of Publication:
United States
Language:
English

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