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Title: 3D Integration of Sensors and Electronics

Abstract

A three dimensional integrated circuit is composed of multiple tiers of integrated electronics and sensors integrated vertically by wafer bonding, thinning and insertion of through-silicon-vias. The technologies associated with three dimensional integrated circuits can provide new capabilities for high energy physics and x-ray imaging experiments. These include finer pixel pitch, lower interconnect capacitance, the ability to separate analog and digital functions, and better power distribution and connectivity. In this paper we review the status of 3DIC demonstration projects at Fermilab, discuss several possible applications, and summarize the current availability of commercial processes. Results of a three-tier demonstration project that includes designs for x-ray imaging, CMS track triggering, and ILC vertex are described. We discuss the status of several ongoing 3D projects and prospects for future evolution of the technology.

Authors:
 [1]
  1. Fermilab
Publication Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Org.:
USDOE Office of Science (SC), High Energy Physics (HEP) (SC-25)
OSTI Identifier:
1529357
Report Number(s):
FERMILAB-CONF-18-732-CMS
1707378
DOE Contract Number:  
AC02-07CH11359
Resource Type:
Conference
Journal Name:
PoS
Additional Journal Information:
Journal Volume: Vertex 2017; Conference: 26th International Workshop on Vertex Detectors, Las Caldas, Asturias, Spain, 09/10-09/15/2017
Country of Publication:
United States
Language:
English
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY

Citation Formats

Lipton, Ronald. 3D Integration of Sensors and Electronics. United States: N. p., 2018. Web. doi:10.22323/1.309.0025.
Lipton, Ronald. 3D Integration of Sensors and Electronics. United States. doi:10.22323/1.309.0025.
Lipton, Ronald. Thu . "3D Integration of Sensors and Electronics". United States. doi:10.22323/1.309.0025. https://www.osti.gov/servlets/purl/1529357.
@article{osti_1529357,
title = {3D Integration of Sensors and Electronics},
author = {Lipton, Ronald},
abstractNote = {A three dimensional integrated circuit is composed of multiple tiers of integrated electronics and sensors integrated vertically by wafer bonding, thinning and insertion of through-silicon-vias. The technologies associated with three dimensional integrated circuits can provide new capabilities for high energy physics and x-ray imaging experiments. These include finer pixel pitch, lower interconnect capacitance, the ability to separate analog and digital functions, and better power distribution and connectivity. In this paper we review the status of 3DIC demonstration projects at Fermilab, discuss several possible applications, and summarize the current availability of commercial processes. Results of a three-tier demonstration project that includes designs for x-ray imaging, CMS track triggering, and ILC vertex are described. We discuss the status of several ongoing 3D projects and prospects for future evolution of the technology.},
doi = {10.22323/1.309.0025},
journal = {PoS},
number = ,
volume = Vertex 2017,
place = {United States},
year = {2018},
month = {8}
}

Conference:
Other availability
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