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Title: Thermal transport in semicrystalline polyethylene by molecular dynamics simulation

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.5006889· OSTI ID:1511161
 [1];  [2];  [3];  [4];  [5]; ORCiD logo [2]
  1. Tongji University, Shanghai (China); North Carolina State Univ., Raleigh, NC (United States)
  2. North Carolina State Univ., Raleigh, NC (United States)
  3. Huazhong University of Science and Technology, Wuhan (China)
  4. Tongji University, Shanghai (China)
  5. Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)

Recent research has highlighted the potential to achieve high-thermal-conductivity polymers by aligning their molecular chains. Combined with other merits, such as low-cost, corrosion resistance, and light weight, such polymers are attractive for heat transfer applications. Due to their quasi-one-dimensional structural nature, the understanding on the thermal transport in those ultra-drawn semicrystalline polymer fibers or films is still lacking. Here, we built the ideal repeating units of semicrystalline polyethylene and studied their dependence of thermal conductivity on different crystallinity and interlamellar topology using the molecular dynamics simulations. We found that the conventional models, such as the Choy-Young's model, the series model, and Takayanagi's model, cannot accurately predict the thermal conductivity of the quasi-one-dimensional semicrystalline polyethylene. A modified Takayanagi's model was proposed to explain the dependence of thermal conductivity on the bridge number at intermediate and high crystallinity. We also analyzed the heat transfer pathways and demonstrated the substantial role of interlamellar bridges in the thermal transport in the semicrystalline polyethylene. Lastly, our work could contribute to the understanding of the structure–property relationship in semicrystalline polymers and shed some light on the development of plastic heat sinks and thermal management in flexible electronics.

Research Organization:
Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
FG02-02ER45977
OSTI ID:
1511161
Alternate ID(s):
OSTI ID: 1415667
Journal Information:
Journal of Applied Physics, Vol. 123, Issue 1; ISSN 0021-8979
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 30 works
Citation information provided by
Web of Science

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Cited By (5)

Thermal Transport in Conductive Polymer–Based Materials journal August 2019
Tailored morphology and highly enhanced phonon transport in polymer fibers: a multiscale computational framework journal December 2019
Chain length effect on thermal transport in amorphous polymers and a structure–thermal conductivity relation journal January 2019
Thermal resistance network model for heat conduction of amorphous polymers journal January 2020
A Thermal Resistance Network Model for Heat Conduction of Amorphous Polymers text January 2019

Figures / Tables (11)


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