High-Temperature Sapphire Pressure Sensors for Harsh Environments
- Univ. of Florida, Gainesville, FL (United States)
- Florida State Univ., Tallahassee, FL (United States)
The project aimed to develop and characterize an optical pressure sensor capable of withstanding high temperatures, up to 1000 °C. Survivability in harsh environments was enabled using sapphire for both the substrate and the optical fibers, therefore mitigating thermal expansion mismatch. Such material cannot be machined through conventional microfabrication techniques, and unique additive and subtractive methods had to be studied and implemented. Subtractive methods included laser-machining the sapphire substrate using a picosecond laser machining tool. At first, the parameters of importance were theoretically and experimentally evaluated such that the fluence, the pulse spacing, and the number of passes were found to strongly influence the laser ablation process. A simulation tool was designed to predict the final pattern when inputting a set of parameters and a profile. This model was complemented with laser ablation material physics models and Bayesian uncertainty analysis for one dimensional and three dimensional ablation processes. An additive process called thermocompression bonding was studied in order to seal the diaphragm substrate to the back cavity. At first, bonding strength using this technique was examined using the chevron-notch method that allow to determine the fracture toughness of this bond. This parameter is independent of the geometry used and therefore can be extended to other geometries used in actual sensor bonding. A theoretical and experimental study of internal damage caused by the laser micromachining of the sapphire material was carried out. The research identified enhanced strength and fracture toughness along laser ablated surfaces. This was determined using bend bar specimens and Vicker’s microindentations. Softening of the plasticity behavior (as indicated by nanoindentation experiments) was also investigated using finite deformation plasticity modeling via a contact mechanics finite element simulation. Good correlations between experiments and the model were achieved to determine material parameters that can be used in future MEMS based sensor design and modeling to minimize sensor failure loads. The enhanced strength and fracture toughness was determined to be due to compressive residual stress near laser ablated surfaces. This was confirmed through x-ray spectra taken along different crystal structure planes in combination and Bayesian uncertainty analysis. The Bayesian analysis inferred the entire residual strain tensor (six components) and the residual stress tensor. The results illustrated compressive in-plane stress was the most likely cause of enhanced strength and toughness after laser machining. Due to major equipment failures, a parallel route for fabricating the sensor was taken, using commercially available sapphire removal method (subtractive) and ceramic adhesive bonding (additive). The fully-packaged sensor utilized laser micromachining for the sapphire substrate fabrication and was comprised only of high-temperature-compatible materials. Calibration tests of the sensor in both room-temperature and high-temperature plane-wave tubes showed good linearity and consistent frequency response, in the tested frequency range. The sensor also showed good thermal stability in tests up to 300 °C, proving the fiber-optic lever and its packaging process to be a promising approach for high-temperature measurements. The calibration from 23 °C to 300 °C gave a raw sensitivity of 3.9 × 10-7 V/Pa and a normalized sensitivity of 9.8 × 10-8 Pa-1 which were consistent within the temperature range. The sensor had a resonance at 16.3 kHz and a flat band (±3 dB) up to 10.3 kHz. The noise floor of the sensor at 1 kHz was 316 nV/Hz1/2, resulting in a MDP of 0.8 Pa. Previously, diaphragm delamination due to CTE mismatch was found at 500 °C, causing packaging failure. Unfortunately high temperature validation in hot jet environment could not be made in time. In the future, it is suggested that the two sapphire substrates be bonded by thermal compression bonding with an intermediate platinum layer instead of using an alumina-based adhesive, and therefore achieve higher temperature capacity up to 1000 °C.
- Research Organization:
- Univ. of Florida, Gainesville, FL (United States)
- Sponsoring Organization:
- USDOE Office of Fossil Energy (FE)
- DOE Contract Number:
- FE0012370
- OSTI ID:
- 1510458
- Report Number(s):
- RPFR
- Country of Publication:
- United States
- Language:
- English
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