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Title: The Mechanical Performance of Sn-Pb Solder Joints on LTCC Substrates.

Abstract

Abstract not provided.

Authors:
; ; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
OSTI Identifier:
1508897
Report Number(s):
SAND2018-3994C
662441
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the International Brazing and Soldering Conference 2018 held April 15-18, 2018 in New Orleans, LA.
Country of Publication:
United States
Language:
English

Citation Formats

Vianco, Paul T., Williams, Shelley, McKenzie, Bonnie B., Kilgo, Alice C., Walsh, Michael, Price, William, and Guerrero, Esteban. The Mechanical Performance of Sn-Pb Solder Joints on LTCC Substrates.. United States: N. p., 2018. Web.
Vianco, Paul T., Williams, Shelley, McKenzie, Bonnie B., Kilgo, Alice C., Walsh, Michael, Price, William, & Guerrero, Esteban. The Mechanical Performance of Sn-Pb Solder Joints on LTCC Substrates.. United States.
Vianco, Paul T., Williams, Shelley, McKenzie, Bonnie B., Kilgo, Alice C., Walsh, Michael, Price, William, and Guerrero, Esteban. Sun . "The Mechanical Performance of Sn-Pb Solder Joints on LTCC Substrates.". United States. https://www.osti.gov/servlets/purl/1508897.
@article{osti_1508897,
title = {The Mechanical Performance of Sn-Pb Solder Joints on LTCC Substrates.},
author = {Vianco, Paul T. and Williams, Shelley and McKenzie, Bonnie B. and Kilgo, Alice C. and Walsh, Michael and Price, William and Guerrero, Esteban},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {4}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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