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Title: Scalable Polymer Nanocomposites with Record High‐Temperature Capacitive Performance Enabled by Rationally Designed Nanostructured Inorganic Fillers

Journal Article · · Advanced Materials

Abstract Next‐generation microelectronics and electrical power systems call for high‐energy‐density dielectric polymeric materials that can operate efficiently under elevated temperatures. However, the currently available polymer dielectrics are limited to relatively low working temperatures. Here, the solution‐processable polymer nanocomposites consisting of readily prepared Al 2 O 3 fillers with systematically varied morphologies including nanoparticles, nanowires, and nanoplates are reported. The field‐dependent electrical conduction of the polymer nanocomposites at elevated temperatures is investigated. A strong dependence of the conduction behavior and breakdown strength of the polymer composites on the filler morphology is revealed experimentally and is further rationalized via computations. The polymer composites containing Al 2 O 3 nanoplates display a record capacitive performance, e.g., a discharged energy density of 3.31 J cm −3 and a charge–discharge efficiency of >90% measured at 450 MV m −1 and 150 °C, significantly outperforming the state‐of‐the‐art dielectric polymers and nanocomposites that are typically prepared via tedious, low‐yield approaches.

Sponsoring Organization:
USDOE
OSTI ID:
1506729
Journal Information:
Advanced Materials, Journal Name: Advanced Materials Vol. 31 Journal Issue: 23; ISSN 0935-9648
Publisher:
Wiley Blackwell (John Wiley & Sons)Copyright Statement
Country of Publication:
Germany
Language:
English
Citation Metrics:
Cited by: 206 works
Citation information provided by
Web of Science

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