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Title: X-ray microdiffraction study of Cu interconnects.

Abstract

No abstract prepared.

Authors:
; ; ; ; ; ; ; ;
Publication Date:
Research Org.:
Advanced Photon Source, Argonne National Lab., IL (US); Univ. of Wisconsin at Madison (US)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
15002806
DOE Contract Number:  
W-31-109-ENG-38
Resource Type:
Journal Article
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Volume: 76; Journal Issue: 3; Other Information: PBD: 17 Jan 2000; Related Information: Jan. 17, 2000
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COPPER; X-RAY DIFFRACTION; CONNECTORS; MICROANALYSIS; ADVANCED PHOTON SOURCE

Citation Formats

Zhang, X, Solak, H, Cerrina, F, Lai, B, Cai, Z, Ilinski, P, Legnini, D, Rodrigues, W, and XFD,. X-ray microdiffraction study of Cu interconnects.. United States: N. p., 2000. Web. doi:10.1063/1.125731.
Zhang, X, Solak, H, Cerrina, F, Lai, B, Cai, Z, Ilinski, P, Legnini, D, Rodrigues, W, & XFD,. X-ray microdiffraction study of Cu interconnects.. United States. https://doi.org/10.1063/1.125731
Zhang, X, Solak, H, Cerrina, F, Lai, B, Cai, Z, Ilinski, P, Legnini, D, Rodrigues, W, and XFD,. 2000. "X-ray microdiffraction study of Cu interconnects.". United States. https://doi.org/10.1063/1.125731.
@article{osti_15002806,
title = {X-ray microdiffraction study of Cu interconnects.},
author = {Zhang, X and Solak, H and Cerrina, F and Lai, B and Cai, Z and Ilinski, P and Legnini, D and Rodrigues, W and XFD,},
abstractNote = {No abstract prepared.},
doi = {10.1063/1.125731},
url = {https://www.osti.gov/biblio/15002806}, journal = {Applied Physics Letters},
number = 3,
volume = 76,
place = {United States},
year = {Mon Jan 17 00:00:00 EST 2000},
month = {Mon Jan 17 00:00:00 EST 2000}
}