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Title: Microstructure Evolution and Effect on Resistivity for Cu Nanointerconnects and Beyond

Abstract

In this paper, we investigate the microstructure evolution in Cu, Co and Ru nanointerconnects and the scaling effect on resistivity. The scaling effect on microstructure of Cu interconnects was analyzed to the 24 nm linewidth for the 14 nm node using a high-resolution TEM precession microdiffraction technique. The TEM study was supplemented by a Monte Carlo simulation to investigate grain growth in nanointerconnects based on local energy minimization. The scaling effect on electrical resistivity was analyzed for Cu, Ru and Co nanointerconnects, taking into account the contributions from surface and grain boundary scatterings. The results for Cu and Co are consistent with recent experiments.

Authors:
 [1];  [2];  [3];  [1]
  1. University of Texas, Austin
  2. GLOBALFOUNDRIES
  3. National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1500067
Report Number(s):
NREL/CP-5K00-73455
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Conference
Resource Relation:
Conference: Presented at the 2018 IEEE International Electron Devices Meeting (IEDM), 1-5 December 2018, San Francisco, California
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 77 NANOSCIENCE AND NANOTECHNOLOGY; Cu nanointerconnects; scaling effects; microstructure; resistivity

Citation Formats

Hu, Szu-Tung, Cao, Linjun, Spinella, Laura, and Ho, Paul S. Microstructure Evolution and Effect on Resistivity for Cu Nanointerconnects and Beyond. United States: N. p., 2019. Web. doi:10.1109/IEDM.2018.8614547.
Hu, Szu-Tung, Cao, Linjun, Spinella, Laura, & Ho, Paul S. Microstructure Evolution and Effect on Resistivity for Cu Nanointerconnects and Beyond. United States. doi:10.1109/IEDM.2018.8614547.
Hu, Szu-Tung, Cao, Linjun, Spinella, Laura, and Ho, Paul S. Thu . "Microstructure Evolution and Effect on Resistivity for Cu Nanointerconnects and Beyond". United States. doi:10.1109/IEDM.2018.8614547.
@article{osti_1500067,
title = {Microstructure Evolution and Effect on Resistivity for Cu Nanointerconnects and Beyond},
author = {Hu, Szu-Tung and Cao, Linjun and Spinella, Laura and Ho, Paul S.},
abstractNote = {In this paper, we investigate the microstructure evolution in Cu, Co and Ru nanointerconnects and the scaling effect on resistivity. The scaling effect on microstructure of Cu interconnects was analyzed to the 24 nm linewidth for the 14 nm node using a high-resolution TEM precession microdiffraction technique. The TEM study was supplemented by a Monte Carlo simulation to investigate grain growth in nanointerconnects based on local energy minimization. The scaling effect on electrical resistivity was analyzed for Cu, Ru and Co nanointerconnects, taking into account the contributions from surface and grain boundary scatterings. The results for Cu and Co are consistent with recent experiments.},
doi = {10.1109/IEDM.2018.8614547},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {1}
}

Conference:
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