Measurements of Backsheet Moisture Permeation and Encapsulant-Substrate Adhesion: Preprint
Conference
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OSTI ID:15000000
Presented at the 2001 NCPV Program Review Meeting: Measurements of backsheet moisture permeation and encapsulant-substrate adhesion. At the March 2001 NCPV workshop on ''Moisture Ingress and High-Voltage Isolation'', industry participants identified several properties associated with PV module durability that are critical for commercial success. These include interface conductivity, adhesion of encapsulants to substrate materials as a function of in-service exposure conditions, and moisture permeation through backsheet materials as a function of temperature. Electrical data is discussed in a companion paper; adhesion and water vapor transmission rate (WVTR) measurements are presented herein.
- Research Organization:
- National Renewable Energy Lab., Golden, CO. (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC36-99-GO10337
- OSTI ID:
- 15000000
- Report Number(s):
- NREL/CP-520-30818; TRN: US200325%%1
- Resource Relation:
- Conference: Presented at the NCPV Program Review Meeting, Lakewood, CO (US), 10/14/2001--10/17/2001; Other Information: PBD: 1 Oct 2001
- Country of Publication:
- United States
- Language:
- English
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