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Title: Mechanically active materials in three-dimensional mesostructures

Abstract

Complex, three-dimensional (3D) mesostructures that incorporate advanced, mechanically active materials are of broad, growing interest for their potential use in many emerging systems. The technology implications range from precision-sensing microelectromechanical systems, to tissue scaffolds that exploit the principles of mechanobiology, to mechanical energy harvesters that support broad bandwidth operation. The work presented here introduces strategies in guided assembly and heterogeneous materials integration as routes to complex, 3D microscale mechanical frameworks that incorporate multiple, independently addressable piezoelectric thin-film actuators for vibratory excitation and precise control. The approach combines transfer printing as a scheme for materials integration with structural buckling as a means for 2D-to-3D geometric transformation, for designs that range from simple, symmetric layouts to complex, hierarchical configurations, on planar or curvilinear surfaces. Systematic experimental and computational studies reveal the underlying characteristics and capabilities, including selective excitation of targeted vibrational modes for simultaneous measurements of viscosity and density of surrounding fluids. The results serve as the foundations for unusual classes of mechanically active 3D mesostructures with unique functions relevant to biosensing, mechanobiology, energy harvesting, and others.

Authors:
ORCiD logo [1]; ORCiD logo [2]; ORCiD logo [2]; ORCiD logo [3]; ORCiD logo [1];  [2];  [1]; ORCiD logo [2];  [2]; ORCiD logo [2]; ORCiD logo [2]; ORCiD logo [2]; ORCiD logo [2]; ORCiD logo [4]; ORCiD logo [5]; ORCiD logo [1]; ORCiD logo [2]; ORCiD logo [5]; ORCiD logo [6]
  1. University of Illinois at Urbana-Champaign, Urbana, IL (United States)
  2. Northwestern Univ., Evanston, IL (United States)
  3. Bristol Univ. (United Kingdom)
  4. Xi’an Jiaotong University, Xi’an, Shaanxi (China)
  5. Tsinghua Univ., Beijing (China)
  6. University of Illinois at Urbana-Champaign, Urbana, IL (United States); Northwestern Univ., Evanston, IL (United States)
Publication Date:
Research Org.:
Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1499946
Grant/Contract Number:  
FG02-07ER46471
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Science Advances
Additional Journal Information:
Journal Volume: 4; Journal Issue: 9; Journal ID: ISSN 2375-2548
Publisher:
AAAS
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Ning, Xin, Yu, Xinge, Wang, Heling, Sun, Rujie, Corman, R. E., Li, Haibo, Lee, Chan Mi, Xue, Yeguang, Chempakasseril, Aditya, Yao, Yao, Zhang, Ziqi, Luan, Haiwen, Wang, Zizheng, Xia, Wei, Feng, Xue, Ewoldt, Randy H., Huang, Yonggang, Zhang, Yihui, and Rogers, John A.. Mechanically active materials in three-dimensional mesostructures. United States: N. p., 2018. Web. doi:10.1126/sciadv.aat8313.
Ning, Xin, Yu, Xinge, Wang, Heling, Sun, Rujie, Corman, R. E., Li, Haibo, Lee, Chan Mi, Xue, Yeguang, Chempakasseril, Aditya, Yao, Yao, Zhang, Ziqi, Luan, Haiwen, Wang, Zizheng, Xia, Wei, Feng, Xue, Ewoldt, Randy H., Huang, Yonggang, Zhang, Yihui, & Rogers, John A.. Mechanically active materials in three-dimensional mesostructures. United States. doi:10.1126/sciadv.aat8313.
Ning, Xin, Yu, Xinge, Wang, Heling, Sun, Rujie, Corman, R. E., Li, Haibo, Lee, Chan Mi, Xue, Yeguang, Chempakasseril, Aditya, Yao, Yao, Zhang, Ziqi, Luan, Haiwen, Wang, Zizheng, Xia, Wei, Feng, Xue, Ewoldt, Randy H., Huang, Yonggang, Zhang, Yihui, and Rogers, John A.. Fri . "Mechanically active materials in three-dimensional mesostructures". United States. doi:10.1126/sciadv.aat8313. https://www.osti.gov/servlets/purl/1499946.
@article{osti_1499946,
title = {Mechanically active materials in three-dimensional mesostructures},
author = {Ning, Xin and Yu, Xinge and Wang, Heling and Sun, Rujie and Corman, R. E. and Li, Haibo and Lee, Chan Mi and Xue, Yeguang and Chempakasseril, Aditya and Yao, Yao and Zhang, Ziqi and Luan, Haiwen and Wang, Zizheng and Xia, Wei and Feng, Xue and Ewoldt, Randy H. and Huang, Yonggang and Zhang, Yihui and Rogers, John A.},
abstractNote = {Complex, three-dimensional (3D) mesostructures that incorporate advanced, mechanically active materials are of broad, growing interest for their potential use in many emerging systems. The technology implications range from precision-sensing microelectromechanical systems, to tissue scaffolds that exploit the principles of mechanobiology, to mechanical energy harvesters that support broad bandwidth operation. The work presented here introduces strategies in guided assembly and heterogeneous materials integration as routes to complex, 3D microscale mechanical frameworks that incorporate multiple, independently addressable piezoelectric thin-film actuators for vibratory excitation and precise control. The approach combines transfer printing as a scheme for materials integration with structural buckling as a means for 2D-to-3D geometric transformation, for designs that range from simple, symmetric layouts to complex, hierarchical configurations, on planar or curvilinear surfaces. Systematic experimental and computational studies reveal the underlying characteristics and capabilities, including selective excitation of targeted vibrational modes for simultaneous measurements of viscosity and density of surrounding fluids. The results serve as the foundations for unusual classes of mechanically active 3D mesostructures with unique functions relevant to biosensing, mechanobiology, energy harvesting, and others.},
doi = {10.1126/sciadv.aat8313},
journal = {Science Advances},
issn = {2375-2548},
number = 9,
volume = 4,
place = {United States},
year = {2018},
month = {9}
}

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Works referenced in this record:

Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling
journal, January 2015


Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication
journal, August 2012

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