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Title: Photoconductive switch package configurations having a profiled resistive element

Abstract

Methods, systems, and devices are disclosed for photoconductive switch package configurations. In some aspects, a photoconductive switch package includes of a wide bandgap photoconductive material (e.g., GaN, ZnO, diamond, AlN, SiC, BN, etc.), a source for energetic photons (e.g., a laser), a mechanism to couple the laser into the switch, and a mechanism for high voltage to enter and leave the switch package. In some implementations, the disclosed photoconductive switch packages can be configured as a three terminal device, e.g., similar to transistors, with one of the terminals being laser input or the voltage input to the laser system.

Inventors:
; ; ; ; ;
Publication Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1496597
Patent Number(s):
10,181,544
Application Number:
15/204,833
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Jul 07
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Nelson, Scott D., Caporaso, George J., Hawkins, Steven A., Nguyen, Hoang T., Sampayan, Stephen, and Wang, Li-Fang. Photoconductive switch package configurations having a profiled resistive element. United States: N. p., 2019. Web.
Nelson, Scott D., Caporaso, George J., Hawkins, Steven A., Nguyen, Hoang T., Sampayan, Stephen, & Wang, Li-Fang. Photoconductive switch package configurations having a profiled resistive element. United States.
Nelson, Scott D., Caporaso, George J., Hawkins, Steven A., Nguyen, Hoang T., Sampayan, Stephen, and Wang, Li-Fang. 2019. "Photoconductive switch package configurations having a profiled resistive element". United States. https://www.osti.gov/servlets/purl/1496597.
@article{osti_1496597,
title = {Photoconductive switch package configurations having a profiled resistive element},
author = {Nelson, Scott D. and Caporaso, George J. and Hawkins, Steven A. and Nguyen, Hoang T. and Sampayan, Stephen and Wang, Li-Fang},
abstractNote = {Methods, systems, and devices are disclosed for photoconductive switch package configurations. In some aspects, a photoconductive switch package includes of a wide bandgap photoconductive material (e.g., GaN, ZnO, diamond, AlN, SiC, BN, etc.), a source for energetic photons (e.g., a laser), a mechanism to couple the laser into the switch, and a mechanism for high voltage to enter and leave the switch package. In some implementations, the disclosed photoconductive switch packages can be configured as a three terminal device, e.g., similar to transistors, with one of the terminals being laser input or the voltage input to the laser system.},
doi = {},
url = {https://www.osti.gov/biblio/1496597}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 15 00:00:00 EST 2019},
month = {Tue Jan 15 00:00:00 EST 2019}
}

Works referenced in this record:

Optically-initiated silicon carbide high voltage switch
patent, February 2012


Image sensor, method and design structure including non-planar reflector
patent, October 2012


Electrical Resistances of Thin Metal Films before and after Artificial Aging by Heating
journal, January 1957


Triaxial cable designs with optimum braided shields
journal, July 1990