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Title: Film capacitor and the method of forming the same

Abstract

A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.

Inventors:
; ; ;
Publication Date:
Research Org.:
GENERAL ELECTRIC COMPANY, Schenectady, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1493604
Patent Number(s):
10,128,044
Application Number:
14/943,433
Assignee:
GENERAL ELECTRIC COMPANY (Schenectady, NY) NETL
DOE Contract Number:  
EE0006433
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Nov 17
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Tan, Daniel Qi, Zhang, Lili, Smolenski, Joseph Lucian, and Sullivan, Jeffrey S. Film capacitor and the method of forming the same. United States: N. p., 2018. Web.
Tan, Daniel Qi, Zhang, Lili, Smolenski, Joseph Lucian, & Sullivan, Jeffrey S. Film capacitor and the method of forming the same. United States.
Tan, Daniel Qi, Zhang, Lili, Smolenski, Joseph Lucian, and Sullivan, Jeffrey S. Tue . "Film capacitor and the method of forming the same". United States. https://www.osti.gov/servlets/purl/1493604.
@article{osti_1493604,
title = {Film capacitor and the method of forming the same},
author = {Tan, Daniel Qi and Zhang, Lili and Smolenski, Joseph Lucian and Sullivan, Jeffrey S.},
abstractNote = {A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {11}
}

Patent:

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